ATS-55150D-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-55150D-C3-R0-ND

Manufacturer Part#:

ATS-55150D-C3-R0

Price: $ 3.14
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 15MM X 15MM X 9.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-55150D-C3-R0 datasheetATS-55150D-C3-R0 Datasheet/PDF
Quantity: 1000
100 +: $ 2.85831
300 +: $ 2.67964
500 +: $ 2.59032
1000 +: $ 2.32236
Stock 1000Can Ship Immediately
$ 3.14
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Push Pin
Shape: Rectangular, Angled Fins
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 300 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Green Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are physical components that are designed to protect delicate electronic components or heat sensitive items from intense heat. The ATS-55150D-C3-R0 is an example of a heat sink that can be used in a variety of devices and applications. It is a high-performance heat sink designed to effectively dissipate excess heat generated by high-power electronics.

The ATS-55150D-C3-R0 is a 2.75"x2.75"x0.71" heatsink that uses a copper base, which is the best metal for effective heat transfer, and it also has a black anodized aluminum fin. This design allows for efficient heat dissipation while occupying minimal space.

The ATS-55150D-C3-R0 is commonly used in high-power LEDs, power supplies, integrated circuits, and other high-heat generating electronic components. It provides effective cooling for those components by dissipating the heat away from them.

The ATS-55150D-C3-R0 works by utilizing the laws of thermodynamics and conduction to transfer heat from the source component to the surface of the heat sink. Heat is transferred to the fin array from the base of the heat sink, where it is then dispersed into the ambient air. This process works best in a well ventilated area and will be more efficient if a fan is used. The fan helps by increasing the air movement which encourages heat dissipation.

The ATS-55150D-C3-R0 is a great choice for many electronic applications. It is a reliable, high-performance heatsink that delivers great cooling ability while keeping components safe from intense heat. Its compact size also makes it great space saver for applications with limited space.

The specific data is subject to PDF, and the above content is for reference

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