| Allicdata Part #: | ATS1280-ND |
| Manufacturer Part#: |
ATS-55150K-C1-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 15MM X 15MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55150K-C1-R0 Datasheet/PDF |
| Quantity: | 234 |
| 1 +: | $ 3.92490 |
| 10 +: | $ 3.81717 |
| 25 +: | $ 3.60511 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.590" (15.00mm) |
| Width: | 0.590" (15.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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ATS-55150K-C1-R0 is a type of thermal - heat sink, which is mainly used for dissipating heat from electronic components or circuits. It is designed to increase the surface area of heat-generating components and transfer the heat away from them into the ambient air.
The heat sink consists of a number of thin metal sheets or fins arranged in a specific pattern. These fins act as channels for the air to flow through, allowing the heat to be dispersed evenly and quickly. The air is drawn through the fins by convection, creating a natural air flow. When the air passes through the fins, it absorbs the heat from the component and carries it away to dissipate into the atmosphere.
The ATS-55150K-C1-R0 is primarily used in the automotive, aerospace and industrial fields. In automotive applications, the device is used to cool electronic components such as ECUs (electronic control units) and ICs (integrated circuits). The heat sink also helps in controlling the temperature inside the vehicle’s cabin by dissipating engine heat. In the aerospace field, it can be used to cool the avionics equipment and reduce the chances of overheating. In industrial applications, the heat sink helps to protect the delicate components and keeps the environment cool. It is also used in the data center industry, as it helps to reduce the heat generated by the servers and improve the efficiency of the computing systems.
The working principle of the heat sink is fairly simple. Its core consists of a base and several fins or air channels. The heat produced by the components is dispersed and dissipated quickly through the fins, as the air flows through them. The air enters through the fins and is heated as it passes through the heat generating components. This hot air is then released out of the heat sink via the fins. The fins also act as a barrier to prevent the heat from transferring from one side of the heat sink to the other.
The ATS-55150K-C1-R0 heat sink can be used for different kinds of electronic components and circuits. Its low thermal resistance and high performance make it an ideal choice for applications where space is limited. The device is also relatively easy to install and maintain. The heat sink can help to maintain the optimum temperature level and reduce energy consumption.
In summary, the ATS-55150K-C1-R0 is a type of thermal - heat sink which is used to dissipate heat from electronic components and circuits. It consists of several fins and air channels which allow the air to flow through and absorb the heat away. The heat sink is mainly used in the automotive, aerospace and industrial fields, where it helps to cool the components and keep the environment cool. The device has low thermal resistance and high performance, making it an ideal choice for applications with limited space. The heat sink has a simple working principle and it is relatively easy to install and maintain, making it a great choice for cooling electronic components.
The specific data is subject to PDF, and the above content is for reference