| Allicdata Part #: | ATS-55170D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55170D-C0-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 17X17X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55170D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-55170D-C0-R0 is a fanless thermal solution designed specifically for applications where a fan or active cooling system is not required or desired. This product was developed by a team of engineers at Advanced Thermal Solutions, Inc. with the goal of providing a reliable, efficient, and cost-effective thermal management alternative.
The design of the ATS-55170D-C0-R0 is composed of several components including a base plate, heat pipe assembly, and a fin structure. The base plate is made of a high performance aluminum alloy, which is designed to absorb most of the heat generated by the electronic component. The plate is then connected to a heat pipe assembly, which is responsible for transferring the heat away from the base plate and then dissipating it away from the device.
The heat pipe assembly has two distinct parts: a wick and a heat conduction path. The wick is composed of a high-efficiency, porous material that is designed to absorb the heat from the base plate and then transfer it through the wick. The conduction path is then responsible for transferring the heat away from the device and dissipating it to the environment.
The fin structure of the ATS-55170D-C0-R0 is constructed of a high-performance aluminum alloy. The fins are designed to provide an increased surface area, thus increasing the efficiency of the heat transfer from the device to the surrounding environment. Due to its design, this product is able to dissipate the heat more efficiently than a fan-based system, allowing it to achieve a higher thermal performance.
The ATS-55170D-C0-R0 is ideally suited for a variety of applications such as personal computers, printers, and consumer electronics. It is a cost-effective and reliable means of providing passive thermal management in an environment where active cooling is not required or desired. Additionally, this product is able to achieve excellent thermal performance and can be adapted to a variety of applications.
The ATS-55170D-C0-R0 is classified as a thermal-heat sink, meaning it works by dissipating heat directly from the device through a specifically designed fin structure. This product is able to effectively manage the heat generated from the electronic components and provide a reliable and efficient way to keep the device cool. This product is designed for applications where a fan or active cooling system is not required or desired, providing a reliable and cost-effective alternative to traditional cooling solutions.
The specific data is subject to PDF, and the above content is for reference