| Allicdata Part #: | ATS-55170K-C0-R0-ND |
| Manufacturer Part#: |
ATS-55170K-C0-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 17X17X14.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55170K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important requirement for any type of machine, from robots and computers to car engines and industrial machinery. Heat sinks, one of the most commonly used methods of dispersing heat away from components, have become increasingly important as the demands for greater performance have grown. The ATS-55170K-C0-R0 is a thermal heat sink designed to keep your components cool.
The ATS-55170K-C0-R0 provides up to 158 W of power dissipation in a 2-layer design. It also features the latest vertical fin technology which offers excellent thermal performance. The extremely rugged construction ensures reliable performance in a wide range of temperatures, and the high thermal capacity allows for substantial power savings. The ATS-55170K-C0-R0 also features an array of mounting and interface options, allowing it to be adapted to most applications.
The ATS-55170K-C0-R0 heat sink uses a combination of aluminium fins and a copper base to distribute heat away from components. The aluminium fins have vertical channels that allow for efficient heat dissipation and maximum air flow. The interface between the base and fins is further enhanced by a unique triple axis clip system, making it easy to mount and secure the heat sink.
The ATS-55170K-C0-R0 heat sink is designed for use in a wide range of applications. From high performance automotive and industrial electronics to medical equipment and server racks, this heat sink is capable of handling extreme temperatures. It is ideal for use in environments where high wattage components are present, such as in solar power systems and car engines. Its flexibility also makes it suitable for small size electronics, as its compact design allows for easy integration into tight spaces.
The ATS-55170K-C0-R0 heat sink works by absorbing and dispersing heat away from its components. Heat is transferred from the base to the fins by way of thermal conduction. The design of the fins optimises air flows, allowing for maximum heat dissipation and efficient cooling. Once the heat has been transferred from the fin to the surrounding air, it is then dissipated away from the heat sink, keeping its components at a stable temperature.
The ATS-55170K-C0-R0 is a highly efficient heat sink that can be used in a variety of applications. Its rugged construction ensures reliable operation in extreme environments, and its high thermal capacity allows for substantial power savings. With its wide range of mounting and interface options, this thermal heat sink is an ideal choice for any application requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference