| Allicdata Part #: | ATS1298-ND |
| Manufacturer Part#: |
ATS-55170R-C1-R0 |
| Price: | $ 4.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 17MM X 17MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55170R-C1-R0 Datasheet/PDF |
| Quantity: | 368 |
| 1 +: | $ 4.35330 |
| 10 +: | $ 4.23360 |
| 25 +: | $ 3.99823 |
| 50 +: | $ 3.76312 |
| 100 +: | $ 3.52787 |
| 250 +: | $ 3.29268 |
| 500 +: | $ 3.05749 |
| 1000 +: | $ 2.99870 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks: ATS-55170R-C1-R0 Application Field and Working Principle
A thermal or heat sink is a device that is designed to transfer heat away from an electronic component or another medium. Thermal heat sinks come in a wide variety of shapes and sizes, and can be made of different materials, including aluminum, copper, and brass. The material that is used to construct a thermal heat sink plays an important role in its performance and efficiency. Heat sinks, like the ATS-55170R-C1-R0, are commonly used in cooling applications, such as computers, laptops, game consoles, and other consumer electronic devices.
The ATS-55170R-C1-R0 is an efficient thermal heat sink that is designed specifically for use in tough environmental conditions. It has a rugged construction that allows it to be used in an outdoor environment and its shockproof casing allows it to withstand severe impacts. The heat sink is constructed from aluminum alloy and features a corrosion-resistant finish for maximum performance. The heat sink also features a wide base for added stability and protection. It is designed for applications that require complete protection against dust, sand, and other debris.
The ATS-55170R-C1-R0 is an excellent tool for cooling applications. It has an innovative design that allows it to dissipate heat effectively and efficiently. The heat sink utilizes a Heat Pipe Cooling System (HPCS) for maximum efficiency. The HPCS is comprised of a series of hollow metal tubes that contain a special liquid. The liquid is heated by the component it is cooling and then travels up the tube where it transfers the heat to the heatsink surface. This enables the heat to be dispelled in a more efficient manner than traditional methods. The HPCS also has a higher surface area than traditional heat sinks, allowing it to disperse heat more effectively.
The ATS-55170R-C1-R0 thermal heat sink is capable of dissipating up to 60 watts of heat and is suitable for a variety of cooling applications. It is compatible with a range of components such as microprocessors and FPGAs. The thermal heat sink comes with a mounting bracket, making it easy to install. The bracket features a special design that ensures a perfect fit.
The ATS-55170R-C1-R0 thermal heat sink is a great choice for cooling applications that require maximum performance. It has a rugged design for ultimate durability and reliability. The heat sink utilizes a Heat Pipe Cooling System (HPCS) for efficient heat transfer and is capable of dissipating up to 60 watts of heat. The heat sink has a wide base for added stability and comes with a mounting bracket for easy installation. It is an ideal choice for a variety of cooling applications, especially those that require complete protection against dust, sand, and other debris.
The specific data is subject to PDF, and the above content is for reference