ATS-55190D-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	24.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction to ATS-55190D-C1-R0
The ATS-55190D-C1-R0 is a thermal heat sink designed specifically for cooling applications. It is an advanced thermal solution utilizing advanced heat sink technology to provide superior performance. This thermal heat sink is designed to provide efficient heat removal from sensitive electronic components. The design of the thermal heat sink allows it to be used in a wide variety of applications.

Application Field of ATS-55190D-C1-R0
The ATS-55190D-C1-R0 is designed to provide efficient cooling in a wide range of application fields such as automotive, aerospace, communications, and industrial. It is also well suited for use in personal computers and can also be used in high-powered gaming systems. The thermal heat sink is highly efficient and can be used in a variety of environments including in areas where ambient temperatures can be very high. The thermal heat sink is designed to provide efficient cooling in temperatures up to 180°F (82°C).

Working Principle of ATS-55190D-C1-R0
The ATS-55190D-C1-R0 uses a unique design utilizing the principles of thermal dynamics to disperse heat. The heat sink has an aluminum anodized base which acts as a heat sink and conducts the heat to the fins. This effectively disperses the heat up and away from the component(s) it is cooling ensuring that the component(s) stay at optimal temperatures. The heat sink is equipped with a pre-drilled mounting pattern for easy installation. The thermal heat sink is also designed to run quietly, with minimal or even no noise.

Benefits of Using ATS-55190D-C1-R0
The ATS-55190D-C1-R0 provides numerous benefits such as improved cooling efficiency and a reduced footprint. The aluminum and anodized design creates a low-profile design that will also provide increased durability. It is compatible with both frontal and rear mounting-styles and will provide efficient cooling for a variety of components. In addition, the heat sink is designed to be lightweight and easy to manage which makes installation and maintenance a breeze. The heat sink is also designed to be low-noise which means it won’t interfere with the operation of the components it’s cooling.

Conclusion
The ATS-55190D-C1-R0 is a highly advanced thermal heat sink designed to provide efficient cooling in a wide range of applications. Its aluminum anodized base and pre-drilled mounting pattern make installation and maintenance a breeze. It is highly efficient and capable of running quietly, with minimal or even no noise. The heat sink is designed to provide efficient cooling for electronic components in temperatures up to 180°F (82°C). It is an ideal thermal heat sink solution for any application requiring efficient cooling, durability, and a low-noise operation.

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