| Allicdata Part #: | ATS-55190W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55190W-C0-R0 |
| Price: | $ 5.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 19X19X24.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55190W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.56876 |
| 30 +: | $ 4.31508 |
| 50 +: | $ 4.06123 |
| 100 +: | $ 3.80740 |
| 250 +: | $ 3.55358 |
| 500 +: | $ 3.29975 |
| 1000 +: | $ 3.23630 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.748" (19.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-55190W-C0-R0 is a thermal-heat sink product designed to optimize heat transfer away from critical components in electric and electronics cooling applications. The device is inserted between the heat source and the ambient environment to dissipate heat efficiently. This type of heat sink is a solution for components that generate high heat in systems with limited space for cooling.
The ATS-55190W-C0-R0 is made up of aluminum alloy material, with a footprint of 33.36mm X 33.36mm, a height of 19.5mm, and an advancement of 0.40mm. The device has a water-based cooling system that prevents the temperature from exceeding the maximum operating temperature (115C) of the device components. Its cooling system also reduces the amount of time needed for the device to reach its target temperature.
The heat sink also has an integrated thin film metallization, which improves the overall heat dissipation capability. The combination of aluminum alloy and thin-film metallization also increases the durability and performance of the device against any changes in its external environment.
The ATS-55190W-C0-R0 operates by utilizing natural convection for airflow. Heat transfer is achieved through the combination of the aluminum alloy and the thin-film metallization. The aluminum dissipates heat away from the critical device components while the thin-film metallization serves as a guide for airflow. When heated, the aluminium alloy absorbs the heat and transmits it away from the critical components, while the thin-film metallization guides the airflow in a uniform direction.
The thermal-heat sink can be used in many different applications such as in handheld devices, aerospace and automotive electronics, communications, network equipment, and medical equipment. It is also ideal for applications that require a small footprint as the device is only 19.5mm high. It has high-effective heat transfer properties and can be used in both air and liquid-cooled applications. It is also corrosion-resistant and has a maximum operating temperature of 115C.
In conclusion, the ATS-55190W-C0-R0 thermal-heat sink provides an effective solution for applications where small footprint and effective heat transfer are required. This product is made of an aluminum alloy with integrated thin-film metallization, creates uniform airflow, and provides long-term corrosion resistance with a maximum operating temperature of 115C. This device is suitable for a variety of applications, particularly those with limited space for cooling.
The specific data is subject to PDF, and the above content is for reference