Allicdata Part #: | ATS-55210K-C0-R0-ND |
Manufacturer Part#: |
ATS-55210K-C0-R0 |
Price: | $ 4.02 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 21X21X14.5MM W/OUT TIM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-55210K-C0-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.65526 |
30 +: | $ 3.45198 |
50 +: | $ 3.24904 |
100 +: | $ 3.04592 |
250 +: | $ 2.84286 |
500 +: | $ 2.63980 |
1000 +: | $ 2.58903 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Fins |
Length: | 0.827" (21.00mm) |
Width: | 0.827" (21.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.571" (14.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 12.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-55210K-C0-R0 is a thermal-based heat sink designed to transfer and remove thermal energy from electrical and electronic components to improve the life expectancy of over-heating components within computers and other applications. The most common heat sinks are made up of several thermally conductive materials, such as aluminum, copper, and other materials, to dissipate the heat away from the source. Some thermal materials, such as aluminum, possess high thermal conductivity, meaning that it is able to dissipate the thermal energy more rapidly and effectively than other materials.
The ATS-55210K-C0-R0 is a device engineered specifically to perform this task. It does so by making use of a heat dissipating material, such as aluminum, as well as a fan system to cool the device. The device is comprised of an aluminum heat plate, the fan, and a liquid crystal display. Additionally, the ATS heat sink is engineered with a sophisticated design which includes fins and a cavity structure in order to create a natural convection axial flow. This means that the air pulled from the fan will be directed to the heat dissipating material, as well as the liquid crystal display, to effectively keep them cooler.
By creating an air flow using the fans that draws air from the bottom of the device and through the cavity structures, the air transfer is accelerated, allowing the heated air to be exhausted then further away from the critical components. This process of air circulation not only increases the overall cooling effect of the device, but also prevents the accumulation of any dust and other debris that could act as insulation against the thermal material. This ensures that the ATS-55210K-C0-R0 operates at its highest efficiency to protect the critical components.
The fan system is adjustable and optimized for the specific application, meaning that it can be adjusted to work at different speeds depending on the heat load and application requirement. The speed of the fan is also adjustable, which makes it possible to maintain a constant air flow, regardless of any changes in the thermal load. The fan system also contains a filter, which keeps any additional dust and debris particles away from the critical components. This enhances the life expectancy of the device by preventing overheating damage.
Lastly, the ATS-55210K-C0-R0 is driven by a powerful liquid crystal display, which is designed to display relevant operational data in order to help monitor the device’s overall performance. This will allow the user to see any changes in thermal efficiency over time, as well as allow the user to troubleshoot any issues that may arise. Additionally, the LCD display can alert the user of any changes in performance, fluctuations or other anomalies.
Overall, the ATS-55210K-C0-R0 is an effective thermal-based heat sink, designed specifically to transfer and remove thermal energy from electrical and electronic components. It combines effective thermal material such as aluminum with an adjustable and powerful fan, as well as a liquid crystal display, to ensure that it operates at its highest potential in order to protect critical components from over-heating. This device is the ideal choice for those looking to protect connected components from the dangers of overheating.
The specific data is subject to PDF, and the above content is for reference