| Allicdata Part #: | ATS1283-ND |
| Manufacturer Part#: |
ATS-55210K-C1-R0 |
| Price: | $ 4.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 21MM X 21MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55210K-C1-R0 Datasheet/PDF |
| Quantity: | 669 |
| 1 +: | $ 4.06350 |
| 10 +: | $ 3.95136 |
| 25 +: | $ 3.73187 |
| 50 +: | $ 3.51238 |
| 100 +: | $ 3.29288 |
| 250 +: | $ 3.07334 |
| 500 +: | $ 2.85381 |
| 1000 +: | $ 2.79893 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-55210K-C1-R0 is a Thermal - Heat Sink, designed to absorb, transfer and dissipate heat from electronic components, reducing the component\'s temperature and preserving its performance. It is often used in high-end applications such as data centers, gaming machines, and other specialized equipment where superior cooling is needed. The heatsink works by exposing its body to ambient air, which in turn transfers the generated heat to the surrounding atmosphere.
The ATS-55210K-C1-R0 is composed of aluminum and copper, which allows for the efficient dissipation of heat. The fins on the device increase the radiating surface area and optimize air circulation around the heatsink. The fin configuration also keeps the temperature inside the heatsink\'s body low, ensuring a higher level of thermal efficiency. Additionally, the fins have small grooves that better distribute the airflow around the device, which helps improve the overall cooling performance.
The ATS-55210K-C1-R0 is a versatile heat sink that can be used in a variety of applications. It can be used for direct cooling, as well as integrated into a system for indirect cooling. As an example, it can be used to cool down CPUs, GPUs, power supplies, as well as other electronic components. In addition, the heatsink is also designed to be compatible with a range of cooling fans, including both 12 and 24V fans.
When the ATS-55210K-C1-R0 is used in direct cooling applications, the cooling fan draws air from the underside of the heatsink, pushing it up and out through the fins. This process forces the heat generated by the component into the atmosphere, while also pushing cooled air from the environment onto the component. When integrated into a system, the fan draws in freely available ambient air, pushing it through the fins and into the component. This helps to further reduce the temperature of the component while also reducing overall system noise.
Overall, the ATS-55210K-C1-R0 is a high quality Thermal - Heat Sink that is designed for superior cooling performance. It is versatile and can be used in a variety of applications, including direct cooling of CPUs, GPUs, and other electronic components. Furthermore, it is designed to be compatible with both 12V and 24V fans, allowing it to be integrated into existing systems. The use of aluminum and copper also ensures that the heat produced by the component is efficiently dissipated into the atmosphere, keeping the device and its components cool and working reliably.
The specific data is subject to PDF, and the above content is for reference