| Allicdata Part #: | ATS-55210R-C0-R0-ND |
| Manufacturer Part#: |
ATS-55210R-C0-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 21X21X19.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55210R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.00239 |
| 30 +: | $ 3.77979 |
| 50 +: | $ 3.55748 |
| 100 +: | $ 3.33509 |
| 250 +: | $ 3.11275 |
| 500 +: | $ 2.89041 |
| 1000 +: | $ 2.83483 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an essential component of the electronics manufacturing industry, and heat sinks are the most common form of thermal management. The ATS-55210R-C0-R0 is a heat sink designed for more advanced applications, providing superior thermal performance and a wider range of application fields. This article will discuss the application fields and working principle of the ATS-55210R-C0-R0 heat sink.
The ATS-55210R-C0-R0 heat sink is designed to handle a variety of electronics cooling needs. It can be used in a variety of electronic devices ranging from mobile phones and tablets to servers and complex industrial systems. Its high performance design is capable of dissipating heat from components operating in extreme conditions, such as high ambient temperatures, high-frequency signals, and high-current densities. The heat sink can also be used in applications where component size is limited, such as low-profile components or components with restricted space.
The ATS-55210R-C0-R0 heat sink is constructed out of an aluminum oxide-filled compound. This material offers superior thermal conductivity and durability compared to conventional aluminum heat sinks. In addition, aluminum oxide-filled compounds are non-sparking, making them ideal for use in environments with flammable gases or liquids. The fins of the heat sink are designed to increase the surface area, which helps to improve heat dissipation. The fins are also spaced in such a way as to reduce the resistance of air flow and optimize the convection process.
The ATS-55210R-C0-R0 heat sink also utilizes a unique design feature called a copper interface. This feature helps to improve the thermal performance of the heat sink by promoting heat transfer between the fins and component. The copper interface is also corrosion-resistant, which helps to ensure a long service life. The heat sink also comes with a special thermal adhesive, which is used to attach it firmly to the component.
The working principle of the ATS-55210R-C0-R0 heat sink is based on the principle of natural convection. Natural convection occurs when hot air rises and cooler air sinks. The unique design of the heat sink utilizes this principle to draw heat away from the component and disperse it into the surrounding air. As the air surrounding the component heats up, it rises, allowing more cooler air to flow in and take its place. In this way, heat is transferred away from the component and dissipated into the air, thus cooling the component.
The ATS-55210R-C0-R0 heat sink is an excellent choice for advanced thermal management applications. It is capable of providing superior thermal performance and is capable of handling a wide range of electronic cooling needs. The unique design of the heat sink, along with its aluminum oxide-filled compounds, improved copper interfaces, and specialized thermal adhesive, make it capable of handling a variety of extreme conditions. The heat sink also utilizes the principle of natural convection to transfer heat away from the component and into the air, thus ensuring adequate cooling.
The specific data is subject to PDF, and the above content is for reference