ATS-55210R-C1-R0

ATS-55210R-C1-R0 Application Field and Working Principle

The ATS-55210R-C1-R0 series of thermal - heat sinks are designed to provide a cost-effective solution for dissipating thermal energy from heat-generating electronic components. The series features a rugged aluminum extrusion body which is capable of dissipating thermal energy over a wide temperature range without adversely affecting the performance of the electronic components. The design utilizes a unique axial fin that is able to provide air passage over the entire perimeter of the heatsink for enhanced cooling performance. The fins are designed to provide a low thermal impedance, which results in a low impedance heat sink providing superior performance. Additionally, the series comes with a variety of mounting options to provide flexible placement and installation options.

The series also includes a variety of accessories that are used to increase the performance of the heat sinks. These include mounting clips, mounting blocks, vent adapters and thermal paste. The mounting clips allow for adjustment in the height and orientation of the heatsink, while the mounting blocks provide a secure fit for the heatsink. The vent adapters are used to increase air circulation around the heatsink and the thermal paste helps in providing a more efficient transfer of thermal energy from the electronic components to the heatsink.

The heat sinks are used in a variety of applications including, but not limited to, servers, telecoms, gaming consoles, data storage systems, automotive electronics and power supplies. In servers and telecoms, the heat sink is used to cool high-speed microprocessors and transistors. In gaming consoles, the heat sink is used to dissipate heat generated by the graphics processor and overclocked memory chips. In data storage systems, the heat sink is used to cool hard drives and RAID arrays. In automotive electronics, the heat sink is used to cool control boards, microcontrollers and transistors. In power supplies, the heat sink is used to dissipate thermal energy generated by components such as transformers and voltage regulators.

The working principle of the ATS-55210R-C1-R0 series follows the same basic principle of thermal transfer as other types of heatsink materials. The thermal energy generated by the electronic components is transferred to the heat sink through conduction. The heat from the electronic components is then dissipated through convection and radiation by means of the fins and the aluminum extrusion body. Additionally, the fins are designed to increase the surface area exposed to the surrounding air, which allows for more efficient transfer of thermal energy from the electronic components to the heatsink.

The ATS-55210R-C1-R0 series of Thermal - Heat Sinks are designed to provide a cost-effective solution for dissipating thermal energy from heat-generating electronic components. The series features a rugged aluminum extrusion body that is capable of dissipating thermal energy over a wide temperature range without adversely affecting the performance of the electronic components. Additionally, the series comes with a variety of mounting options and accessories for flexible placement and installation. The series is used in a variety of applications, such as servers, telecoms, gaming consoles, data storage systems, automotive electronics and power supplies. The working principle of the series follows the same basic principle of thermal transfer as other types of heatsink materials, with the thermal energy generated by the electronic components being transferred to the heat sink through conduction and dissipated through convection and radiation.