| Allicdata Part #: | ATS-55230D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55230D-C0-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 23X23X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55230D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-55230D-C0-R0 is an advanced thermal heat sink. Thermal heat sinks, as the name implies, are designed to absorb and dissipate heat from electronic devices, and the ATS-55230D-C0-R0 provides benchmark thermal performance for large systems. It is well-suited for a variety of industries, including telecommunication, energy, defense, and medical.
At the most basic level, a heat sink is a metal surface that is designed to maximize the surface area exposed to the air in order to dissipate heat away from the device. The design of a heat sink typically includes fins and/or channels that increase the surface area and increase its effectiveness. In many cases, heat sinks are mounted directly to the device, but can also be mounted to a board or other surface. In the case of the ATS-55230D-C0-R0, the heat sink is designed to be attached directly to the device, and includes an integrated clip-on mounting system.
When a device is producing heat, it radiates that heat outwards and away from the device. A heat sink is designed to maximize the surface area exposed to the air in order to effectively absorb and dissipate this thermal energy. As heat is absorbed by the heat sink, it is subsequently dissipated outwards to the air. The efficiency of the heat sink in dissipating heat is directly related to the surface area exposed to the air, and the ATS-55230D-C0-R0 features an optimized cooling surface that maximizes heat dissipation.
The ATS-55230D-C0-R0 also features a specialized fan assembly, which is designed to further improve thermal performance. The fan assembly is comprised of a low-noise, high-efficiency fan, which is mounted directly to the heat sink for optimal cooling performance. In addition, the fan assembly design allows for easy replacement of the fan, should it become damaged or need to be replaced.
Overall, the ATS-55230D-C0-R0 is an excellent choice for thermal management of large electronic devices. By providing a robust cooling solution, the ATS-55230D-C0-R0 can reduce the thermal load on the device, thus improving the reliability and performance of the device. With its integrated fan assembly and optimized cooling surface, the ATS-55230D-C0-R0 is an ideal solution for any industrial application that requires reliable thermal management.
The specific data is subject to PDF, and the above content is for reference