| Allicdata Part #: | ATS1267-ND |
| Manufacturer Part#: |
ATS-55230D-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55230D-C1-R0 Datasheet/PDF |
| Quantity: | 172 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48453 |
| 25 +: | $ 3.39016 |
| 50 +: | $ 3.20191 |
| 100 +: | $ 3.01354 |
| 250 +: | $ 2.82517 |
| 500 +: | $ 2.73100 |
| 1000 +: | $ 2.44848 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal management is essential in many industries, from consumer electronics and medical applications to automotive and robotics. The advanced thermal solutions offered by ATS-55230D-C1-R0 Components extends to even greater application fields, delivering superior performance and long lasting reliability. The ATS-55230D-C1-R0 is a thermal heat sink that is used to dissipate thermal energy produced by electronic components. It uses a combination of heat dissipation and diffusion technology for efficient cooling.
A thermal heat sink is made up of a number of materials that are designed to absorb and dissipate heat. The ATS-55230D-C1-R0 is a compact heat sink constructed using high-grade aluminum extrusions. It utilizes hi-tech heat sinks designed with horizontal fins which maximizes the thermal conductivity and convection performance. The vanishing fin technology and air deflectors are versatile and can be used in a wide range of applications.
The cooling of electronics is important to maintain their efficient performance. The ATS-55230D-C1-R0 heat sink works on the principle of combining heat dissipation and diffusion to achieve optimal cooling. Heat is dissipated by conduction through its high-grade aluminum fins and dissipated by convection, which uses the air movement to spread the heat away from the components. This is achieved by allowing air to pass through the heat sink, allowing air to be drawn away from the component, drawing the heat with it.
The ATS-55230D-C1-R0 features a sleek design, complete with a black anodized finish and hidden mounting holes. This makes it suitable for fitting into tight spaces and maximize the cooling area. This makes it a versatile solution for applications ranging from industrial equipment to consumer electronics, where space is at a premium.
The ATS-55230D-C1-R0 has the ability to dissipate heat quickly and efficiently. It can operate within a wide range of temperatures, from -50°C to +200°C. It also features a wide range of mounting options, and is compatibles with all standard socket systems. The ATS-55230D-C1-R0 has been rigorously tested in different application environments and meets all the industry standards.
The ATS-55230D-C1-R0 thermal heat sink is a highly efficient cooling system for industrial and consumer electronics. Its advanced design and construction, combined with the ability to dissipate heat quickly and effectively, makes it suitable for an array of applications. The ATS-55230D-C1-R0 is an efficient and reliable heat sink solution for any of your thermal management needs.
The specific data is subject to PDF, and the above content is for reference