| Allicdata Part #: | ATS1284-ND |
| Manufacturer Part#: |
ATS-55230K-C1-R0 |
| Price: | $ 4.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55230K-C1-R0 Datasheet/PDF |
| Quantity: | 1255 |
| 1 +: | $ 4.15800 |
| 10 +: | $ 4.04838 |
| 25 +: | $ 3.82360 |
| 50 +: | $ 3.59856 |
| 100 +: | $ 3.37365 |
| 250 +: | $ 3.14874 |
| 500 +: | $ 2.92383 |
| 1000 +: | $ 2.86761 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used to dissipate heat away from the surface of a device or component to help keep it cool. The ATS-55230K-C1-R0 thermal heat sink is designed to provide efficient heat dissipation, enabling the appliance or component to maintain an optimal temperature for operation. This heat sink is ideal for use in a wide range of applications, from consumer electronics to industrial and commercial applications.
The ATS-55230K-C1-R0 heat sink is a highly efficient design, designed to improve device performance with minimal energy waste. It can dissipate heat up to 88.5 BTU/hr, making it ideal for controlling temperatures in high-end devices. The heat sink is made of aluminum alloy and is designed for optimal thermal performance and improved heat transfer.
The ATS-55230K-C1-R0 heat sink is designed for use with a variety of cooling solutions. The heat sink can be used in conjunction with a fan, water cooling, or other active and passive cooling methods. It is also compatible with air cooling systems and other thermal management systems. Additionally, the heat sink can be mounted with standard mounting screws.
The ATS-55230K-C1-R0 heat sink is designed to optimize the performance of the device by managing heat in a more efficient manner. The heat sink features a radiative surface which allows it to efficiently disperse heat away from the base of the device. The heat sink also features fins which increase the dissipation area and optimize the flow of air around it.
The ATS-55230K-C1-R0 thermal heat sink’s design ensures even and smooth heat distribution. This helps reduce the chances of thermal hotspots or local variations in temperature. Additionally, the heat sink is designed to be dust and dirt resistant. This helps reduce the chances of debris or dirt building up in the cooling area of the device, further improving efficiency.
The ATS-55230K-C1-R0 heat sink is suitable for a wide range of applications including computers, servers, communication equipment, industrial automation systems, and other electronic systems. The heat sink can be used for both active and passive cooling solutions. It is designed to be used with a wide range of heat exchangers and fans to ensure optimal cooling performance. The thermal heat sink is also designed for easy installation and maintenance.
The ATS-55230K-C1-R0 thermal heat sink is an ideal solution for thermal management. It is designed to optimize performance and dissipate heat in an efficient manner. The design is designed to be dust and dirt resistant and to provide even and smooth heat distribution. The heat sink is ideal for a wide range of applications and can be used in conjunction with various cooling solutions. It is easy to install, and features an optimized radiative surface for improved heat transfer. The heat sink can help regulate temperature and ensure optimal device performance.
The specific data is subject to PDF, and the above content is for reference