| Allicdata Part #: | ATS-55230R-C0-R0-ND |
| Manufacturer Part#: |
ATS-55230R-C0-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 23X23X19.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55230R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.05972 |
| 30 +: | $ 3.83439 |
| 50 +: | $ 3.60889 |
| 100 +: | $ 3.38329 |
| 250 +: | $ 3.15774 |
| 500 +: | $ 2.93218 |
| 1000 +: | $ 2.87580 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-55230R-C0-R0 is a heat sink that is used in a variety of applications. The purpose of its use is to dissipate the heat generated by a device or component. Heat sinks are used to dissipate heat because it is difficult for a device or component to dissipate heat on its own. If the heat generated is not dissipated, it can cause damage to the device or component.
The ATS-55230R-C0-R0 is well-suited to dissipating large amounts of heat, as it has a larger surface area than many other heat sinks. It is designed to dissipate heat from multiple devices or components, and its specially designed fins help to distribute the heat evenly across the surface. This ensures that the heat is dissipated as efficiently as possible, thereby avoiding any potential damage.
The working principle of the ATS-55230R-C0-R0 is quite simple. Heat is generated by the device or component that it is attached to, and it is then transferred to the thermal plate on the heat sink. The thermal plate is designed to absorb the heat and then dissipate it into the atmosphere via the fins. The fins are designed to have a large surface area so that the heat is dissipated evenly. The fan on the heat sink helps to accelerate the process by blowing air across the fins, thereby dispersing the heat faster.
The ATS-55230R-C0-R0 is used in a variety of applications, such as datacenters, industrial robots, 3D printers, and other similar devices. The heat sink is also used in consumer electronics such as laptops, tablets, and smartphones. In all of these applications, the thermal plate and fins help to dissipate the heat generated by the device, ensuring that it does not cause any damage. In addition to this, the ATS-55230R-C0-R0 can also be used as a heatsink to cool down electronic components such as CPUs and GPUs.
In conclusion, the ATS-55230R-C0-R0 is a thermal - heat sink that is used in a variety of applications. Its main purpose is to dissipate the heat generated by the device or component it is attached to. The working principle of the ATS-55230R-C0-R0 is quite simple; the thermal plate absorbs the heat and then dissipates it into the atmosphere via the fins. The fan on the heat sink helps to accelerate this process by blowing air across the fins. The ATS-55230R-C0-R0 is used in a variety of applications, such as datacenters, industrial robots, 3D printers, and consumer electronics such as laptops, tablets, and smartphones. In all of these applications, the heat sink helps to dissipate heat and prevent any potential damage.
The specific data is subject to PDF, and the above content is for reference