| Allicdata Part #: | ATS1301-ND |
| Manufacturer Part#: |
ATS-55230R-C1-R0 |
| Price: | $ 4.96 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55230R-C1-R0 Datasheet/PDF |
| Quantity: | 96 |
| 1 +: | $ 4.51080 |
| 10 +: | $ 4.38669 |
| 25 +: | $ 4.14288 |
| 50 +: | $ 3.89920 |
| 100 +: | $ 3.65558 |
| 250 +: | $ 3.41186 |
| 500 +: | $ 3.16814 |
| 1000 +: | $ 3.10721 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a key component of any electronic device or system. Heat generated by the components of an electronic device can lead to decreased performance, especially if not properly dissipated. Heat sinks are one of the most common solutions for the dissipation of heat in electronic devices and systems. The ATS-55230R-C1-R0 heat sink is designed for efficient thermal management in a wide variety of applications.
The ATS-55230R-C1-R0 is a aluminum heat sink featuring a two-sided design. Each side of the heat sink features an extruded aluminum profile, with 12 raised fins that act as air channels. The center of the heat sink houses the ATS-55230R-C1-R0 heat-distributing base plate. This plate is designed to efficiently distribute the generated heat around the fins for more effective heat dissipation.
The ATS-55230R-C1-R0 application field is broad. One of its main applications is in computer systems. It is designed to be used in high-power computers, which generate a lot of heat that needs to be efficiently dissipated. Other potential applications include LED lighting, avionics, power distribution, industrial control, and military applications. The heat sink is designed to be stable and reliable, for continuous operation in severe environments.
The ATS-55230R-C1-R0 features a unique dissipation system, designed to be both efficient and effective. It is designed to manage the heat generated by the components of the device, and to ensure that the heat is dissipated without causing any damage to the components or affecting the performance of the device. The fins on the heat sink act as air channels, and the base plate distributes the generated heat efficiently. This ensures that the heat is dissipated quickly and effectively, allowing the device to remain cool and to continue functioning properly without any degradations in performance.
In addition, the ATS-55230R-C1-R0 is designed for easy installation. The two-sided design makes it easy to mount and secure in most applications, and the aluminum alloy construction ensures that the heat sink can stand up to demanding conditions. The heat sink is also lightweight, making it easy to transport and use in a variety of applications.
The ATS-55230R-C1-R0 heat sink is a reliable and efficient solution for thermal management. It is designed to be used in a wide variety of applications, and can handle the high temperatures generated by high-power devices. The unique heat-dissipation system ensures that the heat is dissipated quickly and effectively, while the easy installation ensures that it can be used in a variety of different applications.
The specific data is subject to PDF, and the above content is for reference