| Allicdata Part #: | ATS1268-ND |
| Manufacturer Part#: |
ATS-55250D-C1-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55250D-C1-R0 Datasheet/PDF |
| Quantity: | 84 |
| 1 +: | $ 3.53430 |
| 10 +: | $ 3.43602 |
| 25 +: | $ 3.24526 |
| 50 +: | $ 3.05424 |
| 100 +: | $ 2.86335 |
| 250 +: | $ 2.67246 |
| 500 +: | $ 2.48157 |
| 1000 +: | $ 2.43384 |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks refer to a type of cooling mechanism that dissipates heat generated by devices such as processors, transistors, and other electronic components. It is commonly used to reduce the temperature of the device to ensure it operates optimally and avoids any potential damage from overheating. The ATS-55250D-C1-R0 is a thermal heat sink specifically designed to increase air circulation and promote better cooling.
Application Field
The ATS-55250D-C1-R0 is widely used in many different fields. It is a popular choice for applications such as computer hardware, medical equipment, automotive electronics, or any other device that generates a lot of heat. It is one of the best solutions when it comes to preventing overheating.
Working Principle
The ATS-55250D-C1-R0 works by using air to transfer heat away from the device. It has a highly efficient heat transfer design that helps to spread the heat evenly. It has a series of fins that help to increase air circulation, which helps to improve the cooling efficiency.
The ATS-55250D-C1-R0 is designed to be installed in areas where air circulation is optimal. This helps to reduce the temperature of the device, decrease noise levels, and increase the device\'s life span. It also helps to reduce the thermodynamic load, reducing the stress on components such as processors and transistors.
The ATS-55250D-C1-R0 is the ideal choice for applications where comfort, performance, and efficiency are important. Its highly efficient design and durable construction make it the perfect choice for any situation. It is easy to install and requires minimal maintenance, making it an excellent choice for any application.
The specific data is subject to PDF, and the above content is for reference