| Allicdata Part #: | ATS-55270D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55270D-C0-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 27X27X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55270D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are a great way to keep electronic components cool. They are an affordable, efficient way to dissipate heat generated by components. The ATS-55270D-C0-R0 thermal heat sink is no exception. With its superior performance, the ATS-55270D-C0-R0 thermal heat sink is designed to dissipate the heat from a wide array of electronic components ranging from CPUs to diodes and transistors.
The ATS-55270D-C0-R0 thermal heat sink is specially designed to offer thermal protection to electronic components. It works by creating a large, low-resistance thermal path which dissipates the heat generated away from the component. This reduces the temperature and prevents the component from being damaged due to excessive heat. In addition, the heat sink also dissipates the heat generated to the surrounding air, which further cools the component and its surrounding environment.
The ATS-55270D-C0-R0 thermal heat sink is designed to be lightweight and compact, making it ideal for use in tight spaces. It features a slotted base and fins for increased surface area, which maximizes the heat dissipation from the component. Additionally, the heat sink also comes with air fins and clips for easy installation and high heat dissipation efficiency.
The ATS-55270D-C0-R0 thermal heat sink is especially suited for use in CPUs, as it provides superior thermal protection. The heat sink features an advanced design that offers superior heat dissipation. It features pin fins that reduce the thermal resistance between the heat sink and the component, allowing for faster and more efficient heat dissipation. Additionally, the heat sink also features a large number of fins, which increases the heat dissipation area and help to ensure that the heat generated from the component is dissipated away quickly.
The ATS-55270D-C0-R0 thermal heat sink is designed for use in a variety of applications. It is most commonly used in computers, but it can also be used in other types of electronics, such as amplifiers, power supplies and AV equipment. The ATS-55270D-C0-R0 thermal heat sink is the ideal choice for environments where space is limited and the ambient temperatures can be high.
When properly used, the ATS-55270D-C0-R0 thermal heat sink has the ability to keep components cool and free from damage caused by excessive temperatures. The heat sink features an efficient design that provides superior thermal protection to a wide range of electronic components. It is a highly reliable and affordable solution for cooling electronic components in a variety of applications.
The specific data is subject to PDF, and the above content is for reference