ATS-55270K-C1-R0

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Heat sinks are devices used to efficiently dissipate thermal energy generated from electronic and other machinery requiring cooling. The ATS-55270K-C1-R0 is representative of advanced heat sink technology designed to provide high quality, long-term thermal management for electronic components. This heat sink is designed with integrated copper cooling plates, enabling better thermal performance than aluminum. It also has a high performance, low coefficient of friction composite material as a heat transfer medium, which increases heat dissipation ability and the longevity of the heat sink.

The ATS-55270K-C1-R0 heat sink exhibits remarkable heat dissipating capabilities due to its size, configuration, and construction. The heat sink has two 724mm x 244mm copper plates with a total area of 1,790 square inches and a height of 74.4mm. Apart from its impressive size, the high surface-to-air ratio also helps ensure better thermal management. Moreover, the copper cooling plates are integrated with three 25mm-deep fins, which increases the thermally conductive surface area and allow for greater heat dispersion.

The ATS-55270K-C1-R0 is capable of dissipating up to 420W of thermal energy. It is also designed to operate at low noise levels, making it well-suited for applications where noise control is a priority. It has a thermal resistance of 0.256°C/W, allowing it to handle higher temperatures with greater efficiency. Additionally, its unusually wide temperature range makes it suitable for applications in harsh and changing environmental conditions.

The working principle of the ATS-55270K-C1-R0 is relatively simple and involves two distinct processes. First, the heat generated by the electronic component is transferred from the heatsink’s surface to the atmosphere via convective heat transfer. This process is facilitated by the heat sink’s aluminum base, its integrated copper cooling plates, and its high performance, low friction composite material. Second, as the finned aluminum base is heated, air flows across it, taking away additional thermal energy from the device. This phenomenon is known as forced convection and is responsible for the majority of the heat dissipated by the device.

The ATS-55270K-C1-R0 is an ideal cooling option for a wide variety of applications in both industrial and consumer electronics. Some of the most common uses of this thermal heat sink include personal computers, servers, telecom equipment, medical equipment, and automotive electronics. Its impressive size and cooling capacity make it well-suited for any application requiring top-notch thermal management.

The ATS-55270K-C1-R0 is a testament to modern heat sink technology, providing superior thermal performance and long-term reliability. It is an ideal cooling solution for businesses and individuals looking for an effective way to manage the temperature of their electronic devices. With its high thermal capacity, wide temperature range, and advanced construction, the ATS-55270K-C1-R0 is undoubtedly one of the most advanced and reliable thermal heat sinks available today.

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