| Allicdata Part #: | ATS-55270W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55270W-C0-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 27X27X24.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55270W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an important part of any electronic system. The efficiency and performance of any system, be it for industrial or personal use, can be directly affected by the thermal management strategies it employs. This is particularly the case when dealing with sensitive electronic components, which can be easily damaged if their temperature is not kept within an acceptable range. The ATS-55270W-C0-R0 is a thermal solution designed to provide the exact amount of heat dissipation needed to keep electronic components operating safely and efficiently.
The ATS-55270W-C0-R0 is a heat sink, which is a type of thermal management device. Heat sinks are designed to absorb and dissipate heat away from components, thus maintaining their safe temperature while allowing them to function properly. The ATS-55270W-C0-R0 was specifically designed for high-power applications, such as LED lighting, power sources and automotive electronics. It is an extruded aluminum heat sink that has been designed for optimal performance and maximum heat dissipation, providing high-efficiency cooling with minimal airflow.
The ATS-55270W-C0-R0 features high quality materials and a robust design. Its extruded aluminum body is designed to effectively transfer heat away from the source, while its integrated fins provide additional dissipation. The fin density of the sink is precisely matched to the power rating of the component being cooled, allowing for the most efficient use of the available surface area. The heat sink also features a unique fin design which maximizes airflow and helps reduce air resistance.
The working principle behind the ATS-55270W-C0-R0 is simple and efficient. The heat sink absorbs heat from the component, and the fins disperse it into the surrounding environment. The fins then help to draw in cool air, which keeps the component cool and prevents it from overheating. This process is Repeatable and efficient and helps to ensure the safety of the electronic components.
The ATS-55270W-C0-R0 is an ideal thermal solution for a variety of applications. Its robust design and efficient performance make it ideal for use in industrial and personal applications, such as LED lighting, power sources, automotive electronics, and other sensitive components. The heat sink is also an excellent choice for any high-power applications due to its high quality materials and maximum heat dissipation.
In conclusion, the ATS-55270W-C0-R0 is an excellent thermal solution for a variety of applications. It features a robust design and efficient working principle, making it ideal for use in high-power applications such as LED lighting, power sources, and automotive electronics. In addition to its efficiency and performance, the heat sink also features a high quality construction and fin design, providing maximum dissipation and minimum air resistance. With its efficient working principle and robust design, the ATS-55270W-C0-R0 is an ideal thermal solution for any application.
The specific data is subject to PDF, and the above content is for reference