| Allicdata Part #: | ATS-55290D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55290D-C0-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 29X29X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55290D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an increasingly important factor in the production of modern electronics. With the growth of high powered components and devices, a great deal of heat is generated as a result of the operation of such components. Heat sinks are a crucial part of a good thermal management strategy, allowing electronics manufacturers to keep their components running efficiently and effectively. One of the most efficient and widely used types of heat sinks currently available is the ATS-55290D-C0-R0.
The ATS-55290D-C0-R0 is a finned heat sink designed to provide effective thermal management in a wide variety of applications. It uses a base plate of high grade thermal-conductive material, combined with a series of aluminum fins for maximum cooling capacity. These fins act like small radiators, dissipating the heat from the base plate and radiating it away from the device. The fin design also ensures efficient air circulation, reducing component temperatures to a safe level.
The ATS-55290D-C0-R0 is designed to work with a wide range of components, including high powered CPUs, GPUs, and other scaleable electronics. It provides efficient thermal management for a variety of applications like computers, gaming consoles, and other consumer electronics. It is also compatible with a broad range of power supply circuits and thermal management systems.
When used in combination with a proper thermal management system, the ATS-55290D-C0-R0 is able to maintain stable temperatures in a variety of conditions. The fins are also able to absorb the shock of any sudden changes in environmental conditions. This allows the heat sink to effectively act as a buffer to protect delicate electronics components from any thermal spikes.
In addition to its thermal management capabilities, the ATS-55290D-C0-R0 can also reduce electro-magnetic interference, which is particularly important in applications such as server and circuit board installations. The combination of its cooling and EMI protection abilities makes it highly suitable for use in a variety of applications.
The ATS-55290D-C0-R0 is an effective and efficient heat sink in a wide variety of applications. Its ability to effectively manage heat and protect components from any sudden temperature changes is especially useful in the production of modern electronics. By offering good thermal management, the ATS-55290D-C0-R0 can help to ensure that any device runs smoothly and performs reliably.
The specific data is subject to PDF, and the above content is for reference