Allicdata Part #: | ATS1304-ND |
Manufacturer Part#: |
ATS-55290R-C1-R0 |
Price: | $ 5.19 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 29MM X 29MM X 19.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-55290R-C1-R0 Datasheet/PDF |
Quantity: | 4253 |
1 +: | $ 4.71870 |
10 +: | $ 4.59270 |
25 +: | $ 4.33768 |
50 +: | $ 4.08253 |
100 +: | $ 3.82738 |
250 +: | $ 3.57220 |
500 +: | $ 3.31704 |
1000 +: | $ 3.25324 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.142" (29.00mm) |
Width: | 1.142" (29.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.768" (19.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.50°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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The thermal-heat sink is an important part of any functioning system because it helps regulate the temperature of the system. The ATS-55290R-C1-R0 is a thermal-heat sink designed to optimally cool applications where the temperature is too high for normal operation. It is designed with a clipped fin structure and high-efficiency fin gap to ensure optimal cooling efficiency and reduce noise output. The ATS-55290R-C1-R0 is mainly used in computer platforms and servers to help keep temperatures within normal limits.
The ATS-55290R-C1-R0 thermal-heat sink is composed of a heatsink base and a fin array which is secured to the top of the heatsink base. The base is typically made of copper with a nickel coating for extra heat transfer efficiency and to reduce corrosion. The fin array is made of aluminum and is a highly conductive material for heat transfer. Between each fin is a gap that allows for airflow, which helps dissipate heat from the base. The design of the fin array also helps reduce noise output.
The working principle of the ATS-55290R-C1-R0 thermal-heat sink is based on the principle of thermal conduction. The heatsink base is designed to absorb and dissipate heat from the processor or other components. Heat is transferred from the processor to the heatsink base and then to the fins. The fins are designed to help increase the surface area for maximum heat transfer. The air moving through the fins further enhances this process by dissipating the heat from the fin array and the base.
The ATS-55290R-C1-R0 thermal-heat sink is a powerful and efficient way to regulate temperature in any system. It is designed to withstand high temperatures and also reduce noise output. The fin array and clipped fin design helps manage the amount of heat transferred to the environment and reduces noise output. The ATS-55290R-C1-R0 thermal-heat sink is an essential part of any system where the temperature needs to be kept under control.
The specific data is subject to PDF, and the above content is for reference