ATS-55290W-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.142" (29.00mm)
Width:	1.142" (29.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.965" (24.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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IntroductionThe ATS-55290W-C1-R0 is a thermal-heat sink that is suitable for a wide variety of applications. It is designed to efficiently dissipate heat from high-power, high-density electronic devices such as personal computers, monitors, amplifiers, and various industrial-grade electronic control systems. This thermal-heat sink features a unique design that offers superior performance over traditional solutions.Heat Sink OverviewThe ATS-55290W-C1-R0 is a thermal-heat sink designed to dissipate the heat generated by high-power, high-density electronic components, such as personal computers, monitors, and amplifiers. It consists of an aluminum base heat sink and a series of copper fins that are arranged in a lattice structure. This thermally efficient design is capable of dissipating large amounts of heat efficiently with minimal fan noise.The heat sink’s aluminum base absorbs and transfers heat away from the components into the surrounding air, while the copper fins increase the surface area for better thermal transfer. This design ensures that the heat generated by the electronic components is effectively dissipated away, allowing for improved performance and longer product life.Application FieldThe ATS-55290W-C1-R0 is suitable for a wide variety of applications. It is most commonly used in high-performance personal computers, monitors, and amplifiers, as well as various industrial-grade electronic control systems. This thermal-heat sink is also used in automotive, telecommunications, and networking applications where components require effective cooling to maintain optimum performance.Working PrincipleThe ATS-55290W-C1-R0 operates on the principle of convection. Heat generated by the electronic components is absorbed by the base of the heat sink, which is then transferred into the surrounding air through convection. The copper fins help to increase the convection process by increasing the surface area for thermal transfer and allowing the heat to dissipate quickly and efficiently.ConclusionThe ATS-55290W-C1-R0 is an effective thermal-heat sink designed for a wide range of applications. It works by absorbing the heat generated by the electronic components and transferring it into the surrounding air through convection. This design provides superior cooling performance and improved product life for various high-power, high-density electronic components. The ATS-55290W-C1-R0 is a reliable, cost-effective thermal-heat sink solution, making it an ideal choice for thermal management in diverse applications.

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