| Allicdata Part #: | ATS-55300D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55300D-C0-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55300D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.40011 |
| 30 +: | $ 3.30813 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an important factor for any application that requires high performance. The use of thermal heat sinks is essential in maintaining the temperatures of components in many types of electronic components such as heat processors, power transistors and integrated circuits. The ATS-55300D-C0-R0 heat sink is a popular choice among these applications due to its high performance thermal management capabilities.
The ATS-55300D-C0-R0 heat sink is a thermally-conductive die cast aluminum heat transfer device with a unique shape that maximizes heat transfer at low air flow rates. It is designed to facilitate optimal air flow and provide efficient cooling of the components it cools. The surface area of the ATS-55300D-C0-R0 heat sink has been increased to increase the amount of air that can be cooled. This helps in maintaining the temperature of the electronic components within optimal ranges.
The ATS-55300D-C0-R0 heat sink is rated to handle up to 55A current at 200V which makes it ideal for a variety of thermal management applications. Its thermal conductivity is significantly higher than that of copper and other traditional metals and it has the ability to dissipate heat energy quickly and efficiently. The use of this heat sink improves the overall performance of the electronic components and reduces the chances of overheating.
The ATS-55300D-C0-R0 heat sink is commonly used in applications such as CPUs, GPUs, power transistors, and integrated circuits. The heat sink is designed with a special pin-type fin array that provides higher cooling performance which helps in reducing the temperature of the components and improves their overall performance. It also features a unique shape that serves to maximize the contact between the heat sink and all the components that it is cooling.
The ATS-55300D-C0-R0 heat sink is easy to install and can be used in a variety of different applications. Its unique shape also ensures that it can fit in most space-constrained applications and its aluminum construction offers superior thermal conductivity. The heat sink also has an operating temperature range of -55°C to +200°C which makes it suitable for a variety of different environments.
In summary, the ATS-55300D-C0-R0 heat sink is an effective thermal management solution that is suitable for a variety of applications. It is designed to transfer heat away from electronic components quickly and efficiently, and its unique shape provides higher cooling performance. It is easy to install and its aluminum construction ensures superior thermal conductivity. The ATS-55300D-C0-R0 heat sink is an effective solution for all types of thermal management applications.
The specific data is subject to PDF, and the above content is for reference