
Allicdata Part #: | ATS-55310K-C0-R0-ND |
Manufacturer Part#: |
ATS-55310K-C0-R0 |
Price: | $ 4.40 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 31X31X14.5MM W/OUT TIM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.95577 |
30 +: | $ 3.73611 |
50 +: | $ 3.51628 |
100 +: | $ 3.29654 |
250 +: | $ 3.07677 |
500 +: | $ 2.85700 |
1000 +: | $ 2.80206 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 1.220" (30.99mm) |
Width: | 1.220" (30.99mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.571" (14.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-55310K-C0-R0: An Overview of Its Application Field and Working Principle
Thermal - Heat Sinks are an indispensable part of any industrial infrastructure or technology-related system. These sinks help dissipate the heat generated by the internal components thereby keeping the most effective and efficient working environment. The ATS-55310K-C0-R0 belongs to this particular category and is a highly efficient model of heat sinks designed to maximize the cooling process.
The ATS-55310K-C0-R0 is designed for high power operation and is capable of dissipating heat at high as well as low temperatures. It is constructed with high-quality aluminum which guarantees impeccable efficiency and reliability for a steady and consistent performance. It has a UV-resistant coating that protects against corrosion and UV damage, which makes it suitable for a variety of applications.
This particular heat sink is most appropriate for applications with higher power densities and high temperatures. It has an extremely good thermal conductivity, thanks to the high-quality aluminum and good heat dissipation characteristics. This makes it suitable for a wide range of power amplifiers, high-end audio and video systems as well as the industrial-level power transmission systems.
The ATS-55310K-C0-R0 is capable of effectively dissipating heat from any of the major components that produce heat, such as processors, high-end GPUs, motherboards, cooling fans and more. It can handle heat directly from the main sources or circulating coolants. This makes it the perfect choice for a variety of applications, such as high-end PCs, large-scale server systems, industrial controllers and even more.
The ATS-55310K-C0-R0 features an efficient yet simple working principle. It works by transferring heat from a given source or components to other objects. This process is primarily based on thermodynamics: As heat is transferred from a hotter object to a colder one, cooler temperatures prevail. The heat sink absorbs the heat from the main source and dissipates it either directly or through a cooling fan to the cooler surroundings.
The ATS-55310K-C0-R0 is engineered to provide excellent heat dissipation capabilities along with a lower stress level on the components. This makes it ideal for larger applications and high-intensity cooling solutions. Its simple yet efficient working principle allows for quick and easy integration into the system, allowing it to provide the highest levels of performance in unlikely circumstances.
In conclusion, the ATS-55310K-C0-R0 is an extremely efficient and reliable model of heat sinks designed to maximize heat dissipation and ensure maximum performance under any circumstances. It is most suitable for applications with higher power densities and high temperatures, such as high-end PCs, large-scale server systems and industrial controllers. Additionally, thanks to its simple yet effective working principle, it provides the best cooling and maximum performance while being easy to integrate into any system.
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