ATS-55310K-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1289-ND

Manufacturer Part#:

ATS-55310K-C1-R0

Price: $ 4.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 31MM X 31MM X 14.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-55310K-C1-R0 datasheetATS-55310K-C1-R0 Datasheet/PDF
Quantity: 910
1 +: $ 4.39110
10 +: $ 4.27203
25 +: $ 4.03477
50 +: $ 3.79739
100 +: $ 3.56013
250 +: $ 3.32277
500 +: $ 3.08543
1000 +: $ 3.02609
Stock 910Can Ship Immediately
$ 4.83
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.220" (30.99mm)
Width: 1.220" (30.99mm)
Diameter: --
Height Off Base (Height of Fin): 0.571" (14.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-55310K-C1-R0 is a thermal heat sink used in order to efficiently and quickly dissipate heat in various applications. This product belongs to the family of high quality products from Aavid Thermalloy.

A thermal heat sink is a practical way of allowing heat to escape from a device by increasing the surface area which allows for the heat to spread out. By doing so, it helps maintain the operating temperature of a processor or other electronic components, while also preventing damage to the device. Most importantly, the ATS-55310K-C1-R0 thermal heat sink helps reduce the amount of energy needed to operate the device, which leads to lower operating costs.

The ATS-55310K-C1-R0 thermal heat sink uses an advanced form of heat pipe technology. Heat pipes work by transferring thermal energy from one point to another by means of a heat transfer fluid, which flows through a sealed tube. Heat energy from the device is transferred to the heat pipe which is made with an aluminum block and has a copper composite core. This copper core, in turn, is connected to the top and bottom of the tube in order to facilitate a continuous flow of heat energy through the most efficient route towards the heat sink.

Once the heat energy is transferred to the heat sink, typically an aluminum or copper finned heatsink is used, the heat energy is dissipated by means of radiative and/or convective cooling. Radiative cooling is achieved by allowing the heat energy to pass through the fins of the heatsink, while convective cooling takes place as a result of the air flow around the heatsink itself. In addition, the ATS-55310K-C1-R0 is also equipped with an integrated fan for active cooling, allowing for efficient cooling even in environments where air flow may be restricted.

The ATS-55310K-C1-R0 thermal heat sink is suitable for use in a variety of applications, such as personal computers, gaming consoles, servers, embedded systems, and telecommunications. Owing to its robust construction and superior heat dissipation properties, the ATS-55310K-C1-R0 is a reliable form of thermal management for a wide range of electronic components and systems.

Furthermore, the ATS-55310K-C1-R0 is designed to operate in temperatures from -20°C to +100°C, making it suitable for use in a variety of climates. Additionally, the product is corrosion resistant, rust proof, and lightweight, making it an ideal choice for use in various applications which require durability and reliability. The ATS-55310K-C1-R0 can also be easily mounted onto a structure with the use of mounting hardware.

Overall, the ATS-55310K-C1-R0 thermal heat sink is an excellent choice for use in a variety of applications which require efficient and reliable thermal management solutions. By using this product, users can ensure low-cost, efficient cooling with minimal power consumption. Additionally, thanks to its robust design, the ATS-55310K-C1-R0 is suitable for use in a wide range of environments and climates.

The specific data is subject to PDF, and the above content is for reference

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