| Allicdata Part #: | ATS-55325W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55325W-C0-R0 |
| Price: | $ 5.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 32.5X32.5X24.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55325W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.06646 |
| 30 +: | $ 4.78485 |
| 50 +: | $ 4.50337 |
| 100 +: | $ 4.22188 |
| 250 +: | $ 3.94043 |
| 500 +: | $ 3.65896 |
| 1000 +: | $ 3.58860 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-55325W-C0-R0 is a thermally efficient heat sink. It is designed to transfer heat away from critical electrical components, protecting the components from damage caused by excess heat. The heat sink takes advantage of its unique design to effectively pull heat away from the component, allowing the electronic component to perform under normal conditions.
The ATS-55325W-C0-R0 heat sink is typically made of aluminum and has a thermal conductivity of up to 237 W/m·K. This makes it one of the most efficient heat sinks available in the market. Its unique design also makes it able to dissipate heat at a much faster rate than traditional heat sinks. To take advantage of this feature, the heat sink is usually affixed to the board using a thermal interface material (TIM). The TIM eliminates the need for bulky air gaps between the heat sink and the component, further increasing the heat transfer efficiency. Additionally, the large surface area of the heat sink also helps to quickly spread the heat away from the component.
The ATS-55325W-C0-R0 heat sink is ideal for use in high-power electrical components such as LED drivers, motor controllers, and power modules. Due to its thermal efficiency, it is particularly suitable for high-temperature applications such as in data centers or industrial environments. It is also suitable for applications in automotive, aerospace, and medical devices.
In summary, the ATS-55325W-C0-R0 thermal - heat sink is an effective solution for transferring heat away from critical electrical components. It is ultra-efficient, featuring a thermal conductivity of up to 237 W/m·K, allowing it to dissipate heat at a much faster rate than traditional heat sinks. Furthermore, its large surface area helps to quickly spread the heat away from the component. The heat sink is ideal for use in high-power electrical components such as LED drivers, motor controllers, and power modules and is particularly suitable for high-temperature applications.
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