| Allicdata Part #: | ATS1291-ND |
| Manufacturer Part#: |
ATS-55330K-C1-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55330K-C1-R0 Datasheet/PDF |
| Quantity: | 78 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32936 |
| 25 +: | $ 4.08895 |
| 50 +: | $ 3.84829 |
| 100 +: | $ 3.60782 |
| 250 +: | $ 3.36730 |
| 500 +: | $ 3.12678 |
| 1000 +: | $ 3.06665 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are used to manage heat flow in a variety of applications. ATS-55330K-C1-R0 is a type of heat sink, and is a popular choice for cooling electronic components in industrial and commercial applications. This article will discuss the application field and working principle of ATS-55330K-C1-R0.
The ATS-55330K-C1-R0 is designed to provide excellent thermal performance for a variety of applications, including the cooling of power devices, microprocessors, voltage regulators, LED, and other 4-lead devices. It is made of lightweight aluminum with a fin pitch of 2.5mm, and its fin surface features extruded grooves, which increase heat dissipation. This type of heat sink is available in a variety of sizes and mounting styles to fit almost any application. Its thermal resistance of 0.25°C/W makes it a popular choice for dissipating excess heat from electronic components.
The working principle of the ATS-55330K-C1-R0 is based on the principles of convection and conduction. The fins on the heat sink help to draw heat away from the component it is cooling, by creating a larger surface area to which the heat can be conducted. The combination of convection and conduction results in a more efficient cooling technology, which dissipates the heat more quickly than traditional heat sinks. Additionally, the grooves on the fin’s surface increase air flow, which further enhances the heat sink’s cooling ability.
The ATS-55330K-C1-R0 is a popular choice for power and control systems, as well as medical, automotive, and commercial applications. Its lightweight aluminum construction makes installation easy, and its efficient thermal conductivity means that the component it is cooling will be kept at a safe temperature. Additionally, the variety of sizes and mounting styles makes it a versatile choice for a wide range of applications.
In summary, the ATS-55330K-C1-R0 is a type of heat sink that is used to manage heat flow in a variety of applications. It is made of lightweight aluminum with a fin pitch of 2.5mm, and its grooved fin surface helps to dissipate heat more quickly. The combination of convection and conduction helps to cool the component it is attached to, making it a popular choice for power and control systems, automotive, medical, and commercial applications.
The specific data is subject to PDF, and the above content is for reference