
Allicdata Part #: | ATS-55350D-C0-R0-ND |
Manufacturer Part#: |
ATS-55350D-C0-R0 |
Price: | $ 3.85 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X9.5MM W/OUT TIM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.49524 |
30 +: | $ 3.40074 |
50 +: | $ 3.21174 |
100 +: | $ 3.02280 |
250 +: | $ 2.83387 |
500 +: | $ 2.73940 |
1000 +: | $ 2.45602 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 11.30°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a mechanical component used to disperse heat away from sensitive equipment into the atmosphere by radiation, conduction, and convection. Today, heat sinks are used in virtually every type of electronic device and are essential when it comes to cooling electronic equipment and optimizing its performance.The ATS-55350D-C0-R0 is one type of heat sink used for cooling and dissipating heat generated from electrical and electronic components. Its unique design makes it ideal for a wide range of applications and particularly for high power LEDs, power semiconductors, IGBTs, and diodes.It is a durable and versatile heat sink with an anodized aluminum surface finish to enhance heat transfer and thermal management. It has the capacity to dissipate up to 15W of heat, making it one of the most powerful and reliable heat sinks on the market. As a result, this device is an ideal solution for applications where higher heat dissipation is required.The ATS-55350D-C0-R0 works by absorbing and dissipating heat generated from an electronic component or device to the atmosphere. The device is composed of a structured body that provides optimal thermal performance and effective heat dissipation. This body is made of aluminum to ensure maximum heat conduction.An integrated mounting bracket also increases the heat sinking capacity and allows for flexible mounting options. The back of the heat sink also features numerous tapped holes to provide additional mounting support and secure attachment. In addition, each unit is zinc coated for corrosion resistance and is plated to protect against oxidation.Moreover, the ATS-55350D-C0-R0 heat sink comes with a number of additional features which make it a suitable choice for many of today’s applications. This includes a high temperature stability which enables higher power handling of up to 150W per device and a low thermal resistance which increases power dissipation efficiencies.In addition, the device is also designed with a self alignment function which allows it to provide excellent thermal contact between the heat sink and the component being cooled, thus maximizing its thermal performance. Finally, its durable and robust construction ensures that the heat sink can withstand the high temperatures and be used in a wide range of environments.The ATS-55350D-C0-R0 is a powerful and reliable heat sink that is designed to provide superior thermal transfer for a variety of electronic applications. Its versatility and durability make it a great choice for cooling high power components and performance optimization. With its anodized finish, zinc coating, and various mounting options, the ATS-55350D-C0-R0 will ensure optimal thermal management and enhanced component life cycles.
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