ATS-55350K-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1292-ND

Manufacturer Part#:

ATS-55350K-C1-R0

Price: $ 4.92
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 35MM X 35MM X 14.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-55350K-C1-R0 datasheetATS-55350K-C1-R0 Datasheet/PDF
Quantity: 975
1 +: $ 4.47300
10 +: $ 4.35204
25 +: $ 4.11062
50 +: $ 3.86870
100 +: $ 3.62691
250 +: $ 3.38512
500 +: $ 3.14332
1000 +: $ 3.08287
Stock 975Can Ship Immediately
$ 4.92
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.571" (14.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.90°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-55350K-C1-R0 is an advanced device within the electronic components industry, and is classified by its application field and working principle as Thermal – Heat Sinks. This device excels in its ability to dissipate heat away from a computing device, making it a vital component for today’s releases of technological hardware and software. To better understand this product, this article will explain the working principle of the ATS-55350K-C1-R0, list its key features, and elaborate on its application field.

Working Principle

Thermal – Heat Sinks, like the ATS-55350K-C1-R0, are designed with a basic principle in mind. By using aluminum phase-change material with a special thermal-conductive adhesive, the heatsink is designed to draw heat away from the CPU and other important components on the device. The transfer of heat from the device is accomplished by the aluminum phase-change itself, making it an efficient and effective method to rid the device of excessive heating. As the aluminum phase-change material absorbs the heat, it then transmits it to the heatsink fins, which in turn, disperses the heat into the air.

Key Features

The ATS-55350K-C1-R0 stands out amongst its competition and other models by having key features such as an advanced thermal-conductive adhesive, giving it optimal heat transfer capabilities. This device also has an extremely fast construction time of only forty – five minutes, and when compared to other models, this reduces the effort and cost of the consumer. The ATS-55350K-C1-R0 is also designed with a split design, making it one the more structurally stable designs on the market. This feature also gives the heatsink better cooling capabilities, making it an ideal choice for applications that require significant cooling.

Application Field

The ATS-55350K-C1-R0 is most commonly used in consumer electronics as it’s an excellent choice for drawing heat away from both the CPU and other components in the device, improving the performance. This device is also well-suited to applications that require significant cooling, such as gaming PCs and servers, as the heating and cooling effects provided by this heatsink are significantly improved. The ATS-55350K-C1-R0 is also an excellent choice for applications within industrial environments, being both cost effective and able to provide an efficient cooling solution in place of the previous methods used.

Overall, the ATS-55350K-C1-R0 is an advanced thermal – heat sink which is classified by its application field and working principle. With its advanced features and efficient cooling capabilities, this thermal – heat sink is an excellent choice for any consumer electronics, gaming PCs, servers, and industrial application. This device is easy to install, cost effective, and provides improved cooling for the components of its host device.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics