| Allicdata Part #: | ATS-55350R-C0-R0-ND |
| Manufacturer Part#: |
ATS-55350R-C0-R0 |
| Price: | $ 4.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X19.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55350R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.40685 |
| 30 +: | $ 4.16220 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-55350R-C0-R0 (ATS) is a thermal-heat sink manufactured by Advanced Thermal Solutions, Inc., a company that specializes in thermal management products. The ATS offers an inexpensive and simple solution to heat dissipation, and it is an essential component for any electronics product that runs hot. The ATS is designed to manage the unfavorable situation of hot spots, allowing the heat to be dissipated uniformly throughout the components. The thermal-heat sink works by providing a low-cost heat dissipation solution, which dissipates heat to the air or water in the environment.
The ATS is specifically designed to dissipate the heat in electronic devices and chips in extremely hot environments. It is also designed to be lightweight yet durable, providing a reliable solution to dissipate excess heat. One of the key features of the ATS is its high surface area to mass ratio, which allows it to dissipate heat more efficiently than smaller heat sinks. In addition, the ATS is designed for improved heat dissipation, which reduces the amount of heat build-up in the device.
The working principle behind the ATS is simple and effective. The main mechanism used by the ATS is known as ‘conduction’. This means that the heat generated by the device is transferred from the device to the ATS. The ATS is designed with heat fins, which allow it to be efficient in the heat dissipation process. It also has a special baseplate that distributes the heat evenly over the entire surface area. This efficient distribution of heat helps the device run at optimal temperatures.
The ATS is used in a wide range of applications, including computer electronics, telecommunications, automotive, and medical. Its ability to dissipate heat quickly and predictably makes it an ideal solution for any electronic device. The ATS also provides a cheaper and simpler solution than active cooling systems. The ATS is also flexible, as it can be used with different types of cooling systems, allowing you to choose the right one for your needs.
Overall, the ATS-55350R-C0-R0 is an efficient heat dissipation solution. Its lightweight yet durable design, combined with its high surface area to mass ratio, makes it an effective solution for any electronic device. Furthermore, its low cost and simple design make it an ideal solution for any application.
The specific data is subject to PDF, and the above content is for reference