| Allicdata Part #: | ATS1309-ND |
| Manufacturer Part#: |
ATS-55350R-C1-R0 |
| Price: | $ 5.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 35MM X 35MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55350R-C1-R0 Datasheet/PDF |
| Quantity: | 100 |
| 1 +: | $ 4.89510 |
| 10 +: | $ 4.76469 |
| 25 +: | $ 4.49996 |
| 50 +: | $ 4.23524 |
| 100 +: | $ 3.97051 |
| 250 +: | $ 3.70581 |
| 500 +: | $ 3.44111 |
| 1000 +: | $ 3.37494 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management for electronic components and systems is an important factor in ensuring reliable operations, and many types of thermal management devices are available to assist in this process. The ATS-55350R-C1-R0 from Advanced Thermal Solutions (ATS) is an example of one of these thermal management devices, designed to provide efficient and reliable cooling for a variety of applications. This article will discuss the application field for the ATS-55350R-C1-R0 and the working principles that make it an effective heat sink.
The ATS-55350R-C1-R0 is a heat sink designed for the thermal management of CPUs and GPUs in both commercial and military / industrial applications. It features a solid aluminum construction with fins on the back side of the heat sink to increase the surface area for heat exchange. Additionally, the heat sink fan provides enhanced air flow to reduce temperature even further. The heat sink is equipped with a specially designed friction spring clip to ensure secure and reliable installation.
The ATS-55350R-C1-R0 is a thermal management device designed for reliable heat dissipation in high-performance applications, particularly those applications that need to maintain high temperatures in rapidly changing environments. The heat sink efficiently dissipates the heat through its aluminum fins, while the fan ensures the proper air flow to keep the temperature within acceptable limits. With these features, the ATS-55350R-C1-R0 can be used to maintain both low- and high-temperature components and systems.
The ATS-55350R-C1-R0 is designed to take advantage of the principles of thermal conduction. Heat from the components or systems being cooled is dissipated through the heat sink via three-dimensional convective mechanisms (3DCM). In the 3DCM design, the aluminum fins are configured to act as larger, shorter tunnels for heat dissipation. This allows the heat sink to dissipate more heat in a shorter amount of time, as opposed to traditional designs. Additionally, the special friction spring clip ensures secure and reliable attachment of the heat sink to the components and systems.
The ATS-55350R-C1-R0 is designed for use with processors up to 160 watts, making it a great solution for applications that require reliable cooling solutions. Furthermore, the heat sink can be customized to fit a wide range of applications through its adjustable fan settings. Its aluminum construction is lightweight, and it offers superior thermal performance thanks to its advanced 3D design. Its simplified mounting system also ensures easy installation and removal when needed.
In summary, the ATS-55350R-C1-R0 from Advanced Thermal Solutions is a well designed thermal management device. It takes advantage of the principles of thermal conduction and its 3DCM design allows for efficient heat dissipation. The friction spring clip ensures secure and reliable attachment, and the adjustable fan settings make it an ideal solution for a wide range of applications. The ATS-55350R-C1-R0 is an ideal choice for efficient and reliable cooling of CPUs and GPUs in commercial and military/industrial applications.
The specific data is subject to PDF, and the above content is for reference