| Allicdata Part #: | ATS-55350W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55350W-C0-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X24.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55350W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is a crucial factor in many modern applications, allowing components to perform at peak performance and stay within each component’s power limits. Heat sinks are commonly used to dissipate heat generated by electronics and protect components from heat-related damage. One such high-performance heat sink is the ATS-55350W-C0-R0.
The ATS-55350W-C0-R0 is a high-performance thermal heat sink designed for use in demanding industrial applications. The heat sink is constructed from forged aluminum and is designed to handle high temperatures, allowing components to run at maximum performance without putting any components at risk of damage due to thermal-related factors. The heat sink consists of two individual chambers that are connected together, allowing for efficient heat dissipation and effective air circulation. The heat sink also features fins and ribs that allow for increased surface area, thus increasing its thermal capacity. The heat sink is rated for a maximum airflow of 120 CFM, allowing it to handle extreme loads without compromising its performance.
The ATS-55350W-C0-R0 is most commonly used in industrial applications such as automotive and aerospace applications, where high-performance heat sinks are essential. The heat sink is also well-suited for applications such as power modules, LED lights, and HVAC units. The heat sink is also suitable for use with CPUs and GPUs, allowing for maximum overclocking and enhanced performance.
The ATS-55350W-C0-R0 is designed for use with air-cooling systems, ensuring optimal heat dissipation and efficient air circulation. Air cooling is often preferred for applications that require cooling due to its cost-effectiveness and lack of maintenance needs. Air cooling systems use fans to move air through the system, allowing for maximum heat dissipation. The fans used in air cooling systems can be further optimized to allow for improved performance and increased thermal capacity.
The working principle of the ATS-55350W-C0-R0 heat sink is simple. The heat sink is designed to dissipate heat from hot components by using the fins and ribs to increase the surface area. The increased surface area increases the rate of heat transfer, thus allowing for greater heat dissipation. The air cooling system then pulls the air from the area around the heat sink, thus providing a cooling effect. This cooling effect further increases the rate of heat dissipation, ensuring that the components stay within their power limits.
The ATS-55350W-C0-R0 is a highly efficient thermal heat sink that is designed for use in demanding industrial applications. The heat sink’s high thermal capacity allows it to handle extreme loads without compromising its performance. The heat sink is designed for use with air cooling systems, allowing for maximum heat dissipation and efficient air circulation. This ensures that components stay within their power limits, allowing them to perform at peak performance.
The specific data is subject to PDF, and the above content is for reference