| Allicdata Part #: | ATS1276-ND |
| Manufacturer Part#: |
ATS-55375D-C1-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55375D-C1-R0 Datasheet/PDF |
| Quantity: | 55 |
| 1 +: | $ 3.81150 |
| 10 +: | $ 3.71070 |
| 25 +: | $ 3.50482 |
| 50 +: | $ 3.29855 |
| 100 +: | $ 3.09242 |
| 250 +: | $ 2.88625 |
| 500 +: | $ 2.68010 |
| 1000 +: | $ 2.62856 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are used for both cooling and temperature regulation of electronic components by transferring heat away from their surface and into an external heat sink component, as well as to reduce temperatures in surrounding areas where the heat produced may become dangerous. The ATS-55375D-C1-R0 is an example of such a component. It is a thermal heat sink used as a cooling and temperature regulation device for electronic components.
The ATS-55375D-C1-R0 is a heatsink that is used in a variety of applications, including cooling and regulating temperature in motherboards, CPUs, storage drives, graphic cards, and other electronic components. It is a low-profile heatsink that is designed for cooling, temperature regulation, and providing additional protection against electromagnetic interference (EMI) for electronic components. This heatsink comes with a compatible fan for additional cooling to ensure that all components are kept within their optimal temperature range.
The working principle of the ATS-55375D-C1-R0 is relatively simple. The heat sink component is made from aluminum or copper alloy. The surface area of the heat sink is maximized by utilizing fins that are strategically and evenly spaced to provide the most effective cooling possible. This allows it to dissipate the heat from the electronic components onto the cooling fins where it is further dissipated to the surrounding air.
The ATS-55375D-C1-R0 also features an EMI (electromagnetic interference) shield which helps to reduce EMI interference from nearby electronic components or conductors. It is also designed with a fan that helps to increase the motion of the surrounding air, creating a stronger convection effect which further increases cooling efficiency. The fan also helps to reduce the overall noise levels generated by the cooling system. This makes the ATS-55375D-C1-R0 an ideal solution for electronic components in areas that require low noise levels, such as conference rooms, recording studios, or other similar settings.
In conclusion, the ATS-55375D-C1-R0 is an ideal thermal - heat sink for cooling and temperature regulation of electronic components. It is designed to be low profile to fit in tight spaces, while providing optimal cooling performance. The heatsink also features an EMI shield to reduce EMI interference. Additionally, the fan helps to increase cooling efficiency and reduce noise levels in environments that require low noise levels. This makes the ATS-55375D-C1-R0 an ideal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference