| Allicdata Part #: | ATS-55375K-C0-R0-ND |
| Manufacturer Part#: |
ATS-55375K-C0-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 37X37X14.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55375K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.05972 |
| 30 +: | $ 3.83439 |
| 50 +: | $ 3.60889 |
| 100 +: | $ 3.38329 |
| 250 +: | $ 3.15774 |
| 500 +: | $ 2.93218 |
| 1000 +: | $ 2.87580 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The ATS-55375K-C0-R0 is a type of thermal - heat sink. This type of heat sink is often used to dissipate heat generated by an electronic device such as a computer processor, graphics card, power supply, or memory chips. It is composed of a solid base that contains a top plate, fins, and other cooling components. The heat generated by the electronic device is transferred to the heat sink through the fins. The heat is then dissipated into the surrounding air.
The ATS-55375K-C0-R0 heat sink has a unique design that provides a high level of cooling efficiency. The fins of the heat sink are positioned vertically. This allows for more efficient air flow across the fins, resulting in better cooling. The base of the heat sink is made of anodized aluminum which provides a durable and lightweight base. The top plate contains a variety of thermal spacers for better heat transfer. The fins are composed of anodized copper, which is highly efficient at transferring heat away from the component being cooled.
The ATS-55375K-C0-R0 heat sink is designed to effectively cool a wide range of electronic components. This includes microprocessors, graphics cards, power supplies, memory chips, and other similar components. The heat sink is also capable of cooling components which generate high amounts of heat, such as gaming rigs and cryptocurrency miners.
The working principle of the ATS-55375K-C0-R0 heat sink is based on the principles of conduction, convection, and radiation. Conduction is the process of transferring heat from one point to another through solid material. Convection is the process of transferring heat through fluids, such as air or liquid. Radiation is the process of transferring heat from one point to another without direct physical contact. In order to function effectively, all three processes must be present.
When the electronic device generates heat, the heat is transferred to the heat sink by conduction. The heat is then dissipated through convection, as the air coming into contact with the fins of the heat sink is heated up by the heat from the electronic component. Next, the heat is radiated out, sending the heat away from the component in the form of infrared waves. By following these principles, the heat sink is able to effectively dissipate heat and keep the component cool.
The ATS-55375K-C0-R0 heat sink is a popular choice for those looking for an effective way to cool their electronic components. The unique design of the heat sink ensures that the component will remain cool and functioning optimally. The easy to install design makes it a great choice for a wide range of applications. It is an ideal heat sink for those looking for an effective way to cool their components.
The specific data is subject to PDF, and the above content is for reference