| Allicdata Part #: | ATS-55375W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55375W-C0-R0 |
| Price: | $ 5.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 37.5X37.5X24.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55375W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.15907 |
| 30 +: | $ 4.87221 |
| 50 +: | $ 4.58564 |
| 100 +: | $ 4.29899 |
| 250 +: | $ 4.01239 |
| 500 +: | $ 3.72579 |
| 1000 +: | $ 3.65415 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks are commonly used by electronics manufacturers to keep their electronics running at normal temperatures. The ATS-55375W-C0-R0 is a thermal heat sink produced by ATS with a wide range of applications. As its name suggests, it is composed of aluminum and a set of fins and dissipating units that absorb and spread the heat generated by the electronics, thus preventing it from accumulating in the device.
The ATS-55375W-C0-R0 is particularly suitable for applications such as computer CPUs and other components that generate large amounts of heat. It offers excellent heat dissipation and is capable of handling temperatures up to 150°C, making it suitable for even the hottest components. It also has a virtually silent operation and offers long-term stability.
The ATS-55375W-C0-R0 has a number of features that make it an ideal thermal – heat sink. It is highly efficient, with a very low thermal resistance between the base and the top of the fins. This allows the heat to be dissipated quickly and efficiently, reducing the chance of overheating and damage to the components. Additionally, the fins feature a unique curved design that enables air to circulate more efficiently, further enhancing the cooling capabilities of the device.
The ATS-55375W-C0-R0 also features a low profile design. This allows for easier installation into tight spaces, making it a great choice for many applications. It has also been designed for easy maintenance, with a large number of specially designed areas for attaching additional cables and fan mounting points.
The ATS-55375W-C0-R0 has two key components: the fin stack and the base. The base acts as the heat transfer point between the components and the fins. It is composed of two peltier chips, which use a thermoelectric effect to move heat from one point to another. The fin stack consists of multiple sheets of aluminum that are designed to maximize the surface area for heat transfer. This allows more heat to be transferred from the components to the fins, which in turn dissipate it into the surrounding air.
As a result, the ATS-55375W-C0-R0 is an ideal thermal – heat sink for many applications. It offers excellent performance and reliability, while still being relatively compact. This makes it a great choice for applications that require a reliable and efficient heat management system. Additionally, its low profile design makes it ideal for use in tight spaces, ensuring that any system can be installed with ease.
The specific data is subject to PDF, and the above content is for reference