| Allicdata Part #: | ATS1327-ND |
| Manufacturer Part#: |
ATS-55375W-C1-R0 |
| Price: | $ 6.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55375W-C1-R0 Datasheet/PDF |
| Quantity: | 114 |
| 1 +: | $ 5.73300 |
| 10 +: | $ 5.57802 |
| 25 +: | $ 5.26781 |
| 50 +: | $ 4.95810 |
| 100 +: | $ 4.64820 |
| 250 +: | $ 4.33831 |
| 500 +: | $ 4.02842 |
| 1000 +: | $ 3.95095 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Today, Thermal Heat Sinks are used in many industries. Heat sinks are used to dissipate heat generated by electronic components, PCBs, and circuits in order to maintain a cool environment. As one of the most popular thermal heat sinks, the ATS-55375W-C1-R0 is widely used in many industries, and its application field and working principle should be understood.
The ATS-55375W-C1-R0 is designed to reduce the temperature of circuits, components, and PCBs through forced convection. It is an extruded heat sink with an internal fin structure designed to maximize performance. The fins are designed to increase the surface area and effectively increase the cooling rate by radiating heat away from the circuit boards. Its design also allows for very efficient cooling. The ATS-55375W-C1-R0 has a total length of 112.3 mm, a width of 86.9 mm, and a height of 42.7 mm. It is made of aluminum with a black anodized finish, and its surface is pre-treated to increase the thermal efficiency. It also has a large selection of integrated mounting options, including taps, flanges, threaded or grooved pins, or mounting clips.
The ATS-55375W-C1-R0 is used in a variety of applications in the industrial and consumer sectors. It is most commonly used in the communications, computer, and automotive fields, but it is also used in aerospace, medical, and military applications. It is an excellent choice for cooling printed circuit boards, semiconductors, and other components that generate heat. It is also suitable for cooling items in high humidity or dusty environments. In addition to its wide range of uses, the ATS-55375W-C1-R0 is also suitable for applications in extreme temperature conditions.
The working principle of the ATS-55375W-C1-R0 is heat conduction. It uses the natural properties of aluminum to transfer heat away from the PCB or component by radiating it outwards. It also uses the process of forced convection, which uses fans or other air flow to actively move the heated air away from the PCB or component. This process provides an efficient way to cool the device, and the ATS-55375W-C1-R0’s unique internal fin structure increases the rate of heat transfer.
The ATS-55375W-C1-R0 is one of the most popular thermal heat sinks due to its high-performance design and wide range of applications. It is designed to dissipate heat generated by components, PCBs, or circuits to maintain a cool environment. Its internal fin structure maximizes performance and increases cooling efficiency, and its pre-treated surface further ensures that heat is properly dissipated. The ATS-55375W-C1-R0 is suitable for use in the industrial, computer, and consumer fields, and it is an excellent choice for cooling components in extreme temperature conditions.
The specific data is subject to PDF, and the above content is for reference