ATS-55400D-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction: Thermal - Heat SinksThermal-heat sinks are heat transfer components used to dissipate heat from heat-generating components such as processors, capacitors, and the like. Basically, they are designed to pull the heat away from these components and disperse them into the surrounding environment. The advantages of having a good thermal-heat sink are longer equipment life, improved system efficiency, and lower operating costs.About ATS-55400D-C1-R0ATS-55400D-C1-R0 is a type of thermal-heat sink manufactured by ATS Heat Sink Company. It is designed to provide efficient cooling for a wide variety of applications ranging from HVAC, high-power switching circuits to small form-factor embedded systems and personal computers. It is constructed with aluminum alloy and comes with many features, including large heat dissipation area, low-power consumption, easy installation, and long-lasting reliability.Application FieldThe ATS-55400D-C1-R0 thermal-heat sink can be used in a variety of applications, ranging from HVAC, high-power switching circuits, and small form-factor embedded systems to personal computers and other devices. In general, it can be used in applications where heat dissipation is an important factor.For example, the ATS-55400D-C1-R0 thermal-heat sink can be used in HVAC systems to dissipate heat generated by the components of the system, such as compressors and condensers. It can also be used in high-power switching circuits to reduce the amount of heat the circuit produces. In embedded systems, it can be used to keep components from overheating, making them more reliable and longer lasting. In personal computers, it can be used to extend the life of the computer by dissipating heat from the processor and other components.Working PrincipleThe working principle of the ATS-55400D-C1-R0 thermal-heat sink is quite simple. It consists of a base plate (usually made of aluminum), which is in contact with the component being cooled. The base transfers the heat from the component to the fins, which are then dissipated to the surrounding environment.The transfer of heat from the component to the fins is made possible by convection and radiation. Convection is the flow of air across the fins, which is generated by the movement of air around the heat sink, which in turn is caused by differences in air temperature. Radiation is the transfer of heat through space, which occurs when the fins absorb infrared radiation from the component being cooled.ConclusionThe ATS-55400D-C1-R0 thermal-heat sink is an ideal choice for a wide range of applications, from HVAC systems to personal computers. It has a large heat dissipation area, a low-power consumption, easy installation, and long-lasting reliability. It works by transferring heat from the component to the fins through convection and radiation, so that the heat is dissipated to the surrounding environment.

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