ATS-55400K-C1-R0 Datasheet/PDFThermal - Heat Sinks: ATS-55400K-C1-R0 application field and working principle
Heat sinks have been around for decades now. Used in a wide variety of electronics, they\'re now common components in many computer systems. The ATS-55400K-C1-R0 is a particularly popular thermal management solution due to its robust design and wide range of applications.
Overview of Heat Sinks
Heat sinks are heat release devices which are used to dissipate heat from internal components of an electronic system. Heat sinks are typically designed to maximize surface area to increase heat dissipation. Thermal grease is often used to increase the transfer between the heatsink and hot components. Heat sinks are commonly found on CPUs, GPUs and other electronic components.
The ATS-55400K-C1-R0 Heat Sink
The ATS-55400K-C1-R0 is a heat sink manufactured by Advanced Thermal Solutions, Inc. It is constructed from aluminum and designed to provide robust thermal performance in a wide range of electronic components. It comes in two sizes, 95 mm x 95 mm and 115 mm x 115 mm, and two thicknesses, 12 mm and 14mm, to provide a wide range of applications.
The ATS-55400K-C1-R0 is designed to dissipate a large amount of heat. It has a fin height of 12.5 mm and a thermal resistance of 0.26 °C/W. The low thermal resistance allows the ATS-55400K-C1-R0 to dissipate a significant amount of heat, making it ideal for high-heat applications such as gaming console and desktop applications.
In addition, the ATS-55400K-C1-R0 has a wide range of applications in thermal management. It can be used to cool GPUs, CPUs, memory modules, and even circuit boards. It is also compatible with many socket types, from Intel LGA1150 to AMD FM2+. In addition, the ATS-55400K-C1-R0 is designed for optimal airflow and comes with mounting hardware for easy installation.
Working Principle of the ATS-55400K-C1-R0 Heat Sink
The ATS-55400K-C1-R0 works using a combination of convection and conduction. Heat is first drawn into the heatsink by a layer of thermal grease between the heatsink and the component it is cooling. The heat is then dissipated by the large area of the heatsink, which allows for more efficient heat transfer.
The ATS-55400K-C1-R0 also has an integrated fan which further improves heat dissipation. The fan helps draw heat from the component and releases it into the ambient air. The fan has an operating speed of 1000 RPM and a noise emission of 19.5 dbA. It is designed in such a way that it does not significantly slow down the airflow in the system.
Conclusion
The ATS-55400K-C1-R0 is a robust heat sink designed for a wide range of applications. It has an efficient design which efficiently dissipates heat using a combination of conduction and convection. In addition, the integrated fan helps increase airflow and further improves heat dissipation. The ATS-55400K-C1-R0 is a great thermal management solution for electronics such as gaming consoles and desktop systems.