| Allicdata Part #: | ATS-55400W-C0-R0-ND |
| Manufacturer Part#: |
ATS-55400W-C0-R0 |
| Price: | $ 5.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X24.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55400W-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.20506 |
| 30 +: | $ 4.91589 |
| 50 +: | $ 4.62672 |
| 100 +: | $ 4.33755 |
| 250 +: | $ 4.04838 |
| 500 +: | $ 3.75921 |
| 1000 +: | $ 3.68691 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is a vital element within the electronics industry, as a key factor in the longevity and reliable operation of electronic components and systems. Heat sinks, components that dissipate heat from an object or surface by providing additional surface area, are an integral part of managing thermal loads. ATS-55400W-C0-R0 is an advanced heat sinks which has a wide range of application fields and working principles.
The ATS-55400W-C0-R0 is a low-profile heat sink with a high-performance extrusion process. The fan-less design saves space and reduces overall cost. It can be used in many applications including HVAC systems, industrial power supplies, semiconductor packages, telecom systems, automotive systems, computer systems, and other electronics with high thermal load. The heat sink has an extended life due to the low noise level, and its performance is further improved by the use of a special thermal paste which increases heat transfer between the components and the heat sink.
The ATS-55400W-C0-R0 is made up of multiple aluminum fins that are extruded and bonded together providing increased surface area for dissipating heat. The aluminum fins are also designed to direct airflow to the top and edges of the heat sink for better performance. The thermal paste is applied between the fins and components ensuring efficient heat transfer. The fan-less design offers silent operation and does not require a large airflow, thus preventing dust buildup. Another advantage of the ATS-55400W-C0-R0 is that it is designed with a modular construction that allows for easy installation and maintenance.
The ATS-55400W-C0-R0 is designed to provide maximum cooling performance in high thermal applications. It has a wide range of applications such as industrial and automotive electronics, power supplies, semiconductor packages, computer systems, telecom systems, and general electronics cooling. The modular construction helps to quicken assembly and also simplifies the maintenance of the heat sink. The fan-less design also eliminates the need for fan replacement and reduces noise in the system.
The ATS-55400W-C0-R0 is built with an anodized aluminum construction which provides durable and reliable performance. It is also designed to work with a wide variety of thermal pastes which further improves its performance. The thermal paste helps to increase heat transfer between the components and the heat sink, thus increasing cooling efficiency. The construction also includes a modular design that allows for easy installation.
The ATS-55400W-C0-R0 heat sink is an ideal choice for high thermal applications. It has a wide range of application fields due to its low-profile, high-performance design. The fan-less design also improves system reliability and reduces cost. The thermal paste also helps to increase heat transfer, further increasing the cooling efficiency. The anodized aluminum construction provides durable and reliable performance. Overall, the ATS-55400W-C0-R0 heat sink is an effective and efficient thermal solution for high performance applications.
The specific data is subject to PDF, and the above content is for reference