| Allicdata Part #: | ATS-55425D-C0-R0-ND |
| Manufacturer Part#: |
ATS-55425D-C0-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 42.5X42.5X9.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55425D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.673" (42.50mm) |
| Width: | 1.673" (42.49mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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ATS-55425D-C0-R0 is a high performance thermal solution used in applications that require high cooling. It is a highly efficient heat sink, designed for high-performance applications that can dissipate heat quickly and effectively from high-power heat sources. It offers superior thermal performance, superior heat dissipation, and reduced energy consumption.
Application Field
The ATS-55425D-C0-R0 is ideal for applications such as Industrial PCs and Servers, Embedded and Automotive Applications, Compact PCs, and High-power LED lighting and Street Lighting. It is also highly effective for use in high-end audio and video equipment as well as in multi-channel gaming systems.
It is also suitable for applications that require high thermal performance for systems that are exposed to temperatures ranging from -20 to +110 degrees Celsius. It can also withstand vibration, shock, and high humidity.
Work Principle
The ATS-55425D-C0-R0 works by dissipating heat from the backside heat source, as well as absorbing the heat from the front-side heat source. It does this by harvesting and absorbing the heat from the ambient air. In order to achieve this, the heat sink is designed to be highly efficient through the use of a fin structure which allows more air to be exposed to the heat source. This allows the heat to be efficiently dissipated into the atmosphere.
The structure of the ATS-55425D-C0-R0 also ensures that it has a low thermal resistance. This is achieved by the use of high quality copper which helps increase the rate of heat transfer. In addition, a highly efficient thermal spreader is used, which further enhances the cooling process.
The ATS-55425D-C0-R0 also features an integrated fan which helps dissipate heat into the environment and reduce power consumption. This fan is specifically designed to direct the airflow in a specific way, and ensure that the heat is dissipated in the most efficient manner possible. The fan is also adjustable, allowing the user to adjust the speed to suit the specific application.
Conclusion
The ATS-55425D-C0-R0 is an ideal thermal solution for applications requiring quick and efficient heat dissipation. It features a highly efficient fin design, superior thermal performance, low-thermal resistance, reduced power consumption, and an integrated fan for optimum cooling. All of these features make the ATS-55425D-C0-R0 an excellent choice for applications ranging from industrial PCs to high-power LED lighting.
The specific data is subject to PDF, and the above content is for reference