ATS-55425D-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.673" (42.50mm)
Width:	1.673" (42.49mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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<p>The ATS-55425D-C1-R0 is an innovative and versatile thermal heat sink from ATS Technology. Developed with a combination of advanced materials and cutting-edge technology, it provides superior performance for a wide range of applications. This product is designed to be mounted onto passive or active components in a wide range of operational environments.</p><p>The ATS-55425D-C1-R0 is a highly efficient, thermally conductive and reliable component. It is primarily used to dissipate heat from sensitive components, such as CPUs, GPUs, and FPGAs. The component\'s design consists of multiple aluminum heat sink fins that are designed to maximize thermal transfer. The ATS-55425D-C1-R0 is also designed with an innovative patented mounting system that is designed to ensure consistent contact between the thermal heat sink and the mounted components.</p><p>The ATS-55425D-C1-R0 has been designed to meet the needs of a wide range of applications. It is ideal for applications requiring high temperature operation, such as 3D imaging, server racks, laser engraving, and audio/video applications. It is also suitable for a variety of data acquisition and server applications in which high levels of heat are generated. Additionally, it is designed for applications in which thermal management is paramount, such as medical and military electronic equipment.</p><p>The ATS-55425D-C1-R0 is designed to maximize thermal efficiency while minimizing the amount of energy consumed. By utilizing advanced heat transfer techniques, this component is able to keep components cool without the need for additional cooling components or fans. In addition, it is designed to use less power than traditional air or liquid cooling systems.</p><p>The ATS-55425D-C1-R0 is able to function in a wide range of temperatures, which further enhances its reliability and performance. This component is designed to manage the thermal load for temperatures ranging from -40°C to +125°C. It also offers a low coefficient of thermal expansion, ensuring that it will remain in contact with the component and provide uniform heat dissipation.</p><p>The working principle of a thermal heat sink is simple. Heat is generated by the components that it is mounted to, and this heat is then dissipated by the fins of the heat sink to the surrounding environment. The heat is then transferred away from the component, allowing it to operate at its optimal temperature.</p><p>The ATS-55425D-C1-R0 is also designed to be easy to install and maintain. It features a universal mounting system that is designed to fit most components, and it is also easy to remove and reinstall, if needed. Furthermore, this component is designed for long-term usage, as it is designed to withstand temperatures up to 125°C. The component is also designed to allow for easy cleaning and maintenance.</p><p>The ATS-55425D-C1-R0 is an ideal choice for a wide range of thermal management applications. Its advanced design ensures superior performance in a wide variety of operating environments. It is designed to provide reliable performance and heat dissipation while saving energy and money. As such, it is perfect for applications that require efficient thermal management.</p>

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