| Allicdata Part #: | ATS-55425K-C0-R0-ND |
| Manufacturer Part#: |
ATS-55425K-C0-R0 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 42.5X42.5X14.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55425K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.673" (42.50mm) |
| Width: | 1.673" (42.49mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks have many important applications in the modern world. One such application is the ATS-55425K-C0-R0 heat sink. This device is designed to dissipate heat and lower the temperature of electronic devices that are used in many everyday situations.
The ATS-55425K-C0-R0 is composed of several components that work together to effectively regulate heat. The base is anodized aluminum, which has excellent heat dissipation and thermal conductivity properties. The pins are coated in nickel alloy, which is also a great heat-dissipating material.
The heat sink works by taking the heat generated by the electronic device and converting it into thermal energy. The thermal energy is then dissipated into the ambient air or into a heat-sink material such as graphite. This thermal energy is then extracted from the air or graphite, and the heat sink cools the device.
Another important component of the ATS-55425K-C0-R0 is the fan. The fan works by circulating air around the heat sink, thus ensuring that the heat sink remains cool and the device does not overheat. The fan also helps to improve the device\'s overall performance by increasing air flow.
To ensure that the ATS-55425K-C0-R0 works as efficiently as possible, a series of sensors are placed around the heat sink. These sensors measure the temperature of the heat sink and the device, allowing the user to keep track of the temperature levels. If the temperature exceeds a certain threshold, the user can take action to fix the problem.
The ATS-55425K-C0-R0 is a highly efficient heat sink that is designed to effectively dissipate heat, reduce temperatures, and improve the performance of electronic devices. It is composed of several components, including anodized aluminum, nickel alloy pins, fans, and sensors.
Though ATS-55425K-C0-R0 heat sink is best known for its cooling properties, it can also be used in other applications. For example, it can be used to provide a stable environment for sensitive devices that must remain in a specific temperature range.
In addition, the ATS-55425K-C0-R0 can also be used in a variety of different industries, including the automotive industry, medical industry, electronics industry, and other industries. In the automotive industry, for example, it can be used to cool computer systems, engines, and electronics.
Finally, ATS-55425K-C0-R0 heat sink can also be used in applications that use liquid cooling. This type of cooling involves the circulation of a liquid coolant around the heat sink to cool components and prevent the device from overheating. This type of cooling is often used for sensitive devices, such as laser diode modules, medical imaging equipment, and other electronic components.
Heat sinks are essential for any device that needs to be kept cool and running efficiently. The ATS-55425K-C0-R0 is an excellent example of a thermal-heat sink that is designed to effectively dissipate heat and keep components running smoothly and efficiently.
The specific data is subject to PDF, and the above content is for reference