| Allicdata Part #: | ATS1312-ND |
| Manufacturer Part#: |
ATS-55425R-C1-R0 |
| Price: | $ 4.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 42.5 X 42.5 X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55425R-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 4.11585 |
| 300 +: | $ 3.84147 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.673" (42.50mm) |
| Width: | 1.673" (42.49mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management solutions are essential for most electronic applications to maintain a safe operating temperature. The ATS-55425R-C1-R0 is a thermal-heat sink designed to dissipate the heat generated by an electronic component, such as an IC, in order to keep it within its maximum temperature specifications. The ATS-55425R-C1-R0 is a compact, high performance thermal-heat sink designed to be mounted on a T-Sink heatsink. It has a flat base for easy installation, and is optimized for maximum thermal performance and low windage loss.
The ATS-55425R-C1-R0 is designed to dissipate the heat generated by electronic components and provide effective cooling. The base of the thermal heat sink is designed to be easy to install and provide a reliable heat transfer between the component and the heat sink. The fins are designed for maximum surface area and to ensure strong airflow. The fins are also designed to be highly efficient and to increase the convection rate of air. The thermal-heat sink also features an optimized fan mount to ensure maximum airflow and adequate cooling.
The ATS-55425R-C1-R0 is designed to provide efficient cooling for a variety of applications. The thermal-heat sink is able to cool components in a variety of environments, including extreme temperatures and wide temperature ranges. The thermal-heat sink is also designed to fit into tight spaces and has a low profile for an easier installation. The thermal-heat sink is ideal for cooling high power components, such as CPUs, GPUs, chipsets, and power supplies, as well as ICs and connectors.
The ATS-55425R-C1-R0 utilizes thermal conduction to dissipate heat from the components to the fin array. Thermal conduction is the transfer of heat through the heat sink by contact between the fins and the component. This allows for the efficient dissipation of heat from the component to the surrounding air. The fins of the thermal-heat sink are designed to maximize the surface area to create a large convection area, and to direct the airflow to maximize the cooling effectiveness. In addition, the fins are designed to reduce windage loss, which is the amount of air that is moved away from the heat sink and wasted, and to provide the most efficient heat transfer from the component to the surrounding air.
The ATS-55425R-C1-R0 is designed to provide superior cooling in a variety of applications. The thermal-heat sink is designed to provide efficient cooling even in the most challenging environments. This thermal-heat sink is ideal for electronics applications that require low power and high performance. The ATS-55425R-C1-R0 is an ideal solution for applications such as automotive electronics, consumer electronics, industrial electronics, telecom and medical electronics.
In summary, the ATS-55425R-C1-R0 is a thermal-heat sink that is optimized for efficiency and to provide superior cooling for a wide range of applications. It is designed to be easy to install, has a low profile and is optimized for maximum air flow. The thermal-heat sink utilizes thermal conduction to efficiently dissipate heat and is designed to fit into tight spaces and work well in a variety of environmental conditions. The ATS-55425R-C1-R0 is a superior thermal-heat sink designed for excellent cooling performance in today\'s electronic applications.
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