ATS-55450D-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal-Heat Sinks are designed to dissipate a certain amount of thermal energy from a system or component. In electronics, the heat sink is used to cool components like integrated circuit chips, resistor networks, power transistors or diodes. By having a thermal-heat sink of the correct size and shape, a system can be effectively cooled. The ability of a thermal-heat sink to effectively absorb and dissipate heat from a system or component is determined by its thermal conductivity.In this article, we are introducing the ATS-55450D-C1-R0 which is a particular type of thermal-heat sink that is currently in usage in a number of different applications and has proven to be effective in increasing the efficiency of a system or component.

ATS-55450D-C1-R0 Application Field and Working Principle

The ATS-55450D-C1-R0 thermal-heat sink is a great choice for both industrial and consumer grade applications. It has a solid copper construction with a highly efficient, variable speed fan that is powered by an external source. The thermal-heat sinks are designed to mount on circuit boards easily, making them ideal for various types of electronic applications.The ATS-55450D-C1-R0 thermal-heat sink works by transferring thermal energy away from a system or component. It does this by dissipating the heat through its aluminum fin structure. This aluminum fin structure is crucial as it serves as a large surface area for heat conduction. The large surface area helps dissipate the heat away from the system or component being cooled.The ATS-55450D-C1-R0 thermal-heat sink has a built-in fan that helps accelerate the process of heat dissipation. The fan blades are designed to move air efficiently, allowing for a greater rate of heat dissipation. Additionally, the fan is powered by an external source, which allows it to continuously blow out cool air, thus maximizing the efficiency of the heat sink.The ATS-55450D-C1-R0 thermal-heat sink is great for various applications, ranging from computers and laptops to industrial grade applications. It has also been known to provide improved reliability and performance for a number of electronic components.

Conclusion

The ATS-55450D-C1-R0 thermal-heat sink is a great choice for thermal dissipating applications. It is durable, efficient, and has proven to be effective in increasing the performance and longevity of system and component components. Additionally, its fan powered by an external source makes it even more effective at increasing the rate of heat dissipation.

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