ATS-55450K-C0-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Pin Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.571" (14.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction to ATS-55450K-C0-R0 The ATS-55450K-C0-R0 is a thermal - heat sink designed for the purpose of efficiently dissipating heat from electronic components. It is typically used where high power devices need to dissipate heat generated from operation and therefore thermal management is essential. The ATS-55450K-C0-R0 is a good solution for applications such as industrial equipment, communication systems, medical equipment, automotive systems, power supplies, and high-end computer systems.The ComponentsThe ATS-55450K-C0-R0 is comprised of three main components: a cooling fin, a fan, and a fan-guard. The cooling fin is responsible for providing heat dissipation from the surface of an electronic component. It has high thermal performance and is an effective conductor of heat. The fan is responsible for circulating air over the surface of the cooling fin to assist in the dissipation of heat. The fan-guard is designed to protect the fan blades and the cooling fin from external elements such as dust and other particles.The AdvantagesThe ATS-55450K-C0-R0 offers numerous advantages when compared to other thermal-heat sinks. For example, it operates quietly and efficiently in various environmental conditions, with a noise reduction rating of up to 25dB. It also has an efficient air flow, with a range of 10 - 25 CFM. Additionally, it is corrosion-resistant and designed to last for a long service life. The heat sink also has an innovative three-piece construction, which makes it simple to install and maintain. The Working Principle The ATS-55450K-C0-R0 uses convective heat transfer to cool electronic components. This is the process of how heat from a surface is dissipated into the surrounding atmosphere. The airflow created by the fan circulates over the surface of the fin, transferring heat to the airflow. The air then moves away from the fin, taking the heat with it and dissipating it into the surrounding environment. The heat sink’s performance is dependent on several factors, such as air velocity, temperature, and humidity. The better the airflow, the better the performance of the heat sink. The temperature of the environment is also important; a cooler environment will allow for more efficient dissipation of heat. Finally, the humidity of the environment can have an effect on the performance of the heat sink, as high humidity will reduce the rate of heat transfer. ConclusionThe ATS-55450K-C0-R0 is a thermal - heat sink designed to efficiently dissipate heat from electronic components. It is resistant to corrosion and has a long service life. It operates quietly and efficiently in various environmental conditions, and has an efficient air flow rate ranging from 10 - 25 CFM. Additionally, it utilizes convective heat transfer to dissipate heat from the surface into the surrounding environment. This makes the ATS-55450K-C0-R0 a reliable and effective thermal-heat sink solution for a wide range of applications.

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