| Allicdata Part #: | ATS1296-ND |
| Manufacturer Part#: |
ATS-55450K-C1-R0 |
| Price: | $ 5.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 45MM X 45MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55450K-C1-R0 Datasheet/PDF |
| Quantity: | 53 |
| 1 +: | $ 4.63680 |
| 10 +: | $ 4.51269 |
| 25 +: | $ 4.26182 |
| 50 +: | $ 4.01121 |
| 100 +: | $ 3.76053 |
| 250 +: | $ 3.50983 |
| 500 +: | $ 3.25913 |
| 1000 +: | $ 3.19646 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal-heat sinks are often used as part of a cooling system for electronics components and other heat-generating items. The ATS-55450K-C1-R0 is designed to provide an efficient and reliable solution to this problem. This thermal-heat sink consists of a series of thin copper plates (heat-conducting fins) which form an irregular pattern and cover a large area. The fins are connected to two larger base plates made of aluminum. This thermal-heat sink is also made of lightweight aluminum, making it easy to install and maintain.
The working principle of the ATS-55450K-C1-R0 is based on the principle of radiant heat transfer. This means that the heat generated by the electronics components is transferred to the fins of the thermal-heat sink. As the fins are made of thin copper plates, they absorb the heat and pass it on to the base plates. The aluminum base plates in turn, absorb the heat and radiate it away from the electronics components, thereby preventing them from overheating. The ATS-55450K-C1-R0 is able to provide a more effective cooling solution than other thermal-heat sinks due to its greater surface area and fin pattern.
The ATS-55450K-C1-R0 is designed to dissipate heat from electronic components such as CPUs, GPUs, and power amplifiers. Other components that may benefit from the installation of this thermal-heat sink include graphics cards, servers, and various electronics enclosures. The heat dissipation provided by this thermal-heat sink is optimal when the device is properly mounted. The ATS-55450K-C1-R0 includes a series of mounting points which allows for maximum contact between the thermal-heat sink and the electronics device.
The ATS-55450K-C1-R0 is capable of dissipating heat at a rate of 30W per square inch. It is strong and durable, and has an operating temperature range of -40 to 70 degrees Celsius. This thermal-heat sink is designed to provide an efficient and reliable cooling solution to electronic and other heat-generating components. It is also easy to install and maintain, making it a popular choice for many electronics applications.
The specific data is subject to PDF, and the above content is for reference