ATS-55450W-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1330-ND

Manufacturer Part#:

ATS-55450W-C1-R0

Price: $ 6.47
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 45MM X 45MM X 24.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-55450W-C1-R0 datasheetATS-55450W-C1-R0 Datasheet/PDF
Quantity: 214
1 +: $ 5.88420
10 +: $ 5.72670
25 +: $ 5.40868
50 +: $ 5.09040
100 +: $ 4.77225
250 +: $ 4.45410
500 +: $ 4.13595
1000 +: $ 4.05641
Stock 214Can Ship Immediately
$ 6.47
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.965" (24.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal management devices are essential components in modern electronics applications where their role in device cooling and safety is significant. A key component in this field is the ATS-55450W-C1-R0, a highly effective thermal-management component specifically designed for heat sinks. This article will explain the application field and working principle of the ATS-55450W-C1-R0 in detail.

The ATS-55450W-C1-R0 is a high-performance aluminum heat sink which has been designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs and ASICs. The heat sink works by dissipating excess heat from the component in order to maintain an optimal operating temperature. The ATS-55450W-C1-R0 is constructed from lightweight aluminum and features a unique fin geometry which helps to maximize its surface area and thus increase its cooling efficiency. Additionally, the ATS-55450W-C1-R0 has an anodized black finish which helps to reduce its overall weight while also protecting it from corrosion.

The working principle of the ATS-55450W-C1-R0 is based on the heat transfer cycle. It works by transferring thermal energy from the components to the environment, which is achieved through two different mechanisms. The first is convection, which occurs when the air around the component is transferred into the heat sink, carrying thermal energy away from the component. The second is radiation, which is achieved by the surface of the heat sink radially emitting thermal energy and thus dissipating heat away from the component. As a result of the combination of these two mechanisms, the ATS-55450W-C1-R0 is able to effectively reduce the heat generated by the electronic components, helping to maintain a safe and stable operating temperature.

The ATS-55450W-C1-R0 is an ideal solution for applications where thermal management is of utmost importance. It has been found to be particularly effective in cooling equipment such as computers, laptops, gaming systems and other electronics which generate a lot of heat during operation. Additionally, the ATS-55450W-C1-R0 is also suitable for use in applications where aesthetics and weight need to be taken into consideration, as its lightweight construction and anodized black finish make it an attractive choice.

The ATS-55450W-C1-R0 is an effective thermal-management component, designed specifically for heat sinks. Its heat transfer cycle based working principle makes it ideal for applications where thermal management must be taken into account, such as computers, laptops and gaming systems. Its lightweight construction and unique fin geometry help to maximize its surface area, ensuring that the component is effectively cooled and that optimal operating temperatures are maintained. With its anodized black finish the ATS-55450W-C1-R0 is also suitable for applications where aesthetics and weight are important factors.

The specific data is subject to PDF, and the above content is for reference

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