ATS-56007-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS1338-ND

Manufacturer Part#:

ATS-56007-C3-R0

Price: $ 11.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 45MM X 45MM X 15MM
More Detail: Heat Sink ASIC Aluminum Top Mount
DataSheet: ATS-56007-C3-R0 datasheetATS-56007-C3-R0 Datasheet/PDF
Quantity: 66
1 +: $ 10.43280
10 +: $ 9.85446
25 +: $ 9.27458
50 +: $ 8.69498
100 +: $ 8.11538
250 +: $ 7.53571
500 +: $ 7.39081
Stock 66Can Ship Immediately
$ 11.48
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: ASIC
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.40°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an increasingly prominent factor in industrial and individual projects, and Thermal - Heat Sinks must be selected and used judiciously to ensure the optimal performance of a system. The ATS-56007-C3-R0 is an excellent choice for this purpose due to its versatility and a variety of features designed to optimize its thermal management. This article looks at the application field and working principle of the ATS-56007-C3-R0.

The ATS-56007-C3-R0 is ideal for commercial and industrial applications where air cooling is not effective or not practical. This heat sink is thermally efficient, making it suitable for high power applications such as laser diodes, high power LEDs, and Class D amplifiers. It is also designed for surface mounting, giving it better heat dissipation performance and improved thermal management. The device is also highly rugged, making it suitable for industrial applications where vibration and shock can be an issue.

The ATS-56007-C3-R0 has a unique design that is essential for its effective thermal management. It features two sets of fins, each with a different shape, that work together to absorb and dissipate heat more effectively. The fins are arranged in a diamond configuration, which ensures an even distribution of air over the surface of the heat sink. The diamond configuration also allows for lower thermal resistances between the fins, increasing the heat transfer rate. Additionally, the diamond configuration provides more surface area for heat dissipation, which improves the performance of the device.

The ATS-56007-C3-R0 uses a combination of natural convection and forced convection to ensure optimal thermal management. Natural convection occurs when the heat radiates from the device and flows away from the heat sink, whereas forced convection occurs when a fan or other external element creates a vacuum which pulls heat away from the heat sink. Forced convection is much more effective than natural convection, and the ATS-56007-C3-R0 is designed to take advantage of both types of convection to maximize its thermal management performance.

The ATS-56007-C3-R0 is also designed for high power applications. Its high thermal conductivity and low thermal resistance allow it to dissipate heat quickly and efficiently, especially when coupled with a metal casing. This ensures that the device can handle high power demands without risking overheating. The low thermal resistance also reduces wasted power, making the device more energy efficient.

The ATS-56007-C3-R0 is an excellent choice for a variety of applications. Its thermal management features make it an ideal choice for applications where air cooling is not practicable, and its high thermal conductivity and low thermal resistance make it suitable for high power applications. It is also highly rugged, making it suitable for industrial applications. Ultimately, the ATS-56007-C3-R0 is an excellent choice for any application where thermal management efficiency is critical.

The specific data is subject to PDF, and the above content is for reference

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