| Allicdata Part #: | ATS1342-ND |
| Manufacturer Part#: |
ATS-56011-C3-R0 |
| Price: | $ 15.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 57.5 X 57.5 X 12.5MM |
| More Detail: | Heat Sink ASIC Aluminum Top Mount |
| DataSheet: |  ATS-56011-C3-R0 Datasheet/PDF |
| Quantity: | 62 |
| 1 +: | $ 14.19390 |
| 10 +: | $ 13.40260 |
| 25 +: | $ 12.61410 |
| 50 +: | $ 11.82560 |
| 100 +: | $ 11.03730 |
| 250 +: | $ 10.24890 |
| 500 +: | $ 10.05180 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | ASIC |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 2.264" (57.50mm) |
| Width: | 2.264" (57.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks play an integral role in dissipating excess heat away from electrical components such as processors, memory and LED circuits. ATS-56011-C3-R0 is a high-performance heat sink, usually made from aluminum or copper, and designed to effectively mitigate heat away from components for the extension of their lifespan and improved system performance. It is particularly useful in cooling high-powered electrical components such as CPUs and transistors that generate substantial amounts of heat as part of their operation.
The key features of ATS-56011-C3-R0 include multiple fin designs, a thinner, more compact structure and low air flow resistance. It achieves superior heat dissipation than single-fin solutions – making it an ideal cooling solution for high-end processors. In fact, it is one of the most reliable, and one of the best performing, heat sink options currently available on the market.
The design of the ATS-56011-C3-R0 incorporates a series of bars, or fins, that provide a greater surface area on which heat can be dissipated when air passes over them. Thermal energy is absorbed by the fins, which dissipates it into the surrounding environment. This is known as convective cooling, which is a natural phenomenon that occurs when air moves over a surface.
The main components of this heat sink include a base plate and a body. The base plate is usually made from copper or aluminum, and it is designed to dissipate heat more efficiently than the body. The body usually consists of one or more fans, depending on the size and type of heat sink, and is designed to direct airflow over the surface of the fins, allowing for greater heat transfer.
Once the airflow is directed over the fins, it carries the heat away and out of the device. This helps to improve device performance and to reduce the possibility of overheating and damage. The effectiveness of this type of cooling system can be maximized by ensuring that there is adequate airflow over the fins.
In addition, the ATS-56011-C3-R0 is designed with an efficient mounting system, which ensures that components are mounted securely and aligned optimally. This helps to improve thermal performance, and to reduce the chance of vibration and noise.
Overall, the ATS-56011-C3-R0 is an excellent choice for cooling high-powered electronics. It is highly effective in dissipating large amounts of thermal energy and, thanks to its effective mounting system, can be easily and securely installed into any electrical system. It is an ideal choice for applications where space and weight are of particular importance.
The specific data is subject to PDF, and the above content is for reference